Supermicro Introduces a New Petascale All-Flash Storage Server Using NVIDIA Grace CPU Superchip for High Performance Software-Defined AI Storage Workloads
New System Combines NVIDIA Power Efficient CPU with Supermicro's Petascale Architecture
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Supermicro Adds Portfolio for Next Wave of AI with NVIDIA Blackwell Ultra Solutions, Featuring NVIDIA HGX™ B300 NVL16 and GB300 NVL72
Air- and Liquid-Cooled Optimized Solutions with Enhanced AI FLOPs and HBM3e Capacity, with up to 800 Gb/s Direct-to-GPU Networking Performance
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Supermicro Expands Enterprise AI Portfolio of over 100 GPU-Optimized Systems Supporting the Upcoming NVIDIA RTX PRO 6000 Blackwell Server Edition and NVIDIA H200 NVL Platform
With a Broad Range of Form Factors, Supermicro’s Expanded Portfolio of PCIe GPU Systems Can Scale to the Most Demanding Data Center Requirements, with up to 10 Double Width GPUs to Low Power Intelligent Edge Systems Providing Maximum Flexibility and Optimization for Enterprise AI LLM-Inference Workloads
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Supermicro Brings Superior Performance and Efficiency to AI at the Edge
New Servers Drive Smarter, Faster, and More Efficient AI from the Data Center to the Edge with Entire Range of Intel® Xeon® 6 Processors Supporting Over 40% More Memory Bandwidth and up to 144 CPU Cores
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Supermicro Expands US Manufacturing Capacity and Development of Industry-Leading Total IT Solutions with Third Campus in Silicon Valley
Supermicro Drives Innovation, Job Creation, and Economic Growth in San Jose's Thriving Tech Market
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Supermicro Files Form 10-K for Fiscal 2024 and Forms 10-Q for the First and Second Quarters of Fiscal 2025
With These Filings, All Outstanding Financial Statements are Now Filed with No Restatements of Previously Filed Financial Statements, and the Company has Regained Compliance with the NASDAQ Filing Requirements
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Supermicro Ramps Full Production of NVIDIA Blackwell Rack-Scale Solutions with NVIDIA HGX B200
Supermicro Offers Next-Generation Air-Cooled and Liquid-Cooled Architecture for NVIDIA Blackwell Platform
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Supermicro Empowers AI-driven Capabilities for Enterprise, Retail, and Edge Server Solutions
Retailers Can Leverage AI to Increase Revenue and Reduce Costs with Supermicro and NVIDIA's Collaboration
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Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads
Completely Upgraded Servers with the New Intel® Xeon® 6900 Series Processors with P-Cores Optimized for Maximum Performance are Now Shipping in Volume, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and the Industry's Leading Direct-to-Chip Liquid Cooling Solutions
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Supermicro 在 Supercomputing Conference 2024 展览上展示最大规模的 HPC 最佳化多节点系统组合
全新的 FlexTwin™ 和新一代 SuperBlade® 最大限度地提高了计算密度，每个机架最多可容纳 36,864 个内核，采用直接芯片液冷技术和升级技术，最大限度地提高了高性能计算性能
加州圣何塞和亚特兰大2024年11月21日 /美通社/ -- Supercomputing Conference — Supermicro, Inc. (纳斯达克: SMCI) 是人工智能/机器学习、HPC、云、存储和 5G/Edge 的整体 IT 解决方案提供商，正在展示其最新的高计算密度多节点解决方案，这些解决方案针对高强度 HPC 工作负载进行了优化。这些系统包括创新的液冷 FlexTwin 2U 4 节点专用 HPC 架构，以及业界领先的 SuperBlade，可在 6U 或 8U 机箱中容纳多达 20 个节点，并提供一系列存储驱动器选项。 每个 SuperBlade 可以为每个节点容纳 NVIDIA GPU，从而加速特定的应用程序。Supermicro 多节点具有共享资源，可提高效率并减少原材料的使用，与标准机架式系统相比，密度显著提高.
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