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ハイエンドマザーボード

第 2 世代のインテル® Xeon® スケーラブルプロセッサー搭載

Supermicroの自社設計の優位性は、コンピューターのニーズに合わせて仕立てることです

1993 年以来続く高い技術力によって設計されたマザーボード
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Special Features

Global SKU(22)

All motherboardsPrintCopy to clipboardURL522 Results

X14SDW-42C-SP9F

X14SDW-42C-SP9F

Key Features

Intel® Xeon® 6 SoC 6556P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel vRAN Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 4.0 x8 via MCIO connector
2 PCIe 5.0 x16 via Riser slot
12 SFP28 for 25GbE Ethernet with Intel SoC
1 RJ45 for Gigabit Ethernet with Intel® Ethernet Controller i210IT
2 SMA for 1PPS (1 Input 1 Output), 1x SMA for GNSS input with onboard GNSS module
IEEE1588 v2 & Synchronous Ethernet support, DPLL/OCXO design, Up to 8 hours hold-over
Onboard TPM2.0
12V DC or ATX Power Input

X14SDW-42C-SP9F

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X14SDW-36CE-SP9F

X14SDW-36CE-SP9F

Key Features

Intel® Xeon® 6 SoC 6726P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator, extended working temperature
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 4.0 x8 via MCIO connector
2 PCIe 5.0 x16 via Riser slot
8 25GbE SFP28 with Intel SoC
1 1GbE RJ-45 with Intel® Ethernet Controller i210IT
2 SMA for 1PPS (1 Input 1 Output), 1x SMA for GNSS input with onboard GNSS module
IEEE1588 v2 & Synchronous Ethernet support, DPLL/OCXO design, Up to 8 hours hold-over
Onboard TPM2.0
12V DC or ATX Power Input

X14SDW-36CE-SP9F

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X14SDW-36C-SP9F

X14SDW-36C-SP9F

Key Features

Intel® Xeon® 6 SoC 6556P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 4.0 x8 via MCIO connector
2 PCIe 5.0 x16 via Riser slot
8 25GbE SFP28 with Intel SoC
1 1GbE RJ-45 with Intel® Ethernet Controller i210IT
2 SMA for 1PPS (1 Input 1 Output), 1x SMA for GNSS input with onboard GNSS module
IEEE1588 v2 & Synchronous Ethernet support, DPLL/OCXO design, Up to 8 hours hold-over
Onboard TPM2.0
12V DC or ATX Power Input

X14SDW-36C-SP9F

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X14SDV-42C-SP3F

X14SDV-42C-SP3F

Key Features

Intel® Xeon® 6 SoC 6726P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel vRAN Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
2 PCIe 5.0 x8 via MCIO connectors
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
Onboard TPM2.0
12V DC or ATX Power Input

X14SDV-42C-SP3F

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X14SDV-36CE-SP3F

X14SDV-36CE-SP3F

Key Features

Intel® Xeon® 6 SoC 6556P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator, extended working temperature
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
2 PCIe 5.0 x8 via MCIO connectors
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
Onboard TPM2.0
12V DC or ATX Power Input

X14SDV-36CE-SP3F

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X14SDV-36C-SP3F

X14SDV-36C-SP3F

Key Features

Intel® Xeon® 6 SoC 6553P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel Media Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
2 PCIe 5.0 x8 via MCIO connectors
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
Onboard TPM2.0
12V DC or ATX Power Input

X14SDV-36C-SP3F

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X14SDV-32C-SP3F

X14SDV-32C-SP3F

Key Features

Intel® Xeon® 6 SoC 6546P-B, CPU TDP 195W, Intel Quick Assist Technology, Intel vRAN Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
2 PCIe 5.0 x8 via MCIO connectors
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
Onboard TPM2.0
12V DC or ATX Power Input

X14SDV-32C-SP3F

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X14SDV-20C-SP3F

X14SDV-20C-SP3F

Key Features

Intel® Xeon® 6 SoC 6516P-B, CPU TDP 145W, Intel Quick Assist Technology, Intel vRAN Accelerator
System on Chip
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
2 PCIe 5.0 x8 via MCIO connectors
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
Onboard TPM2.0
12V DC or ATX Power Input

X14SDV-20C-SP3F

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X14SBW-TF

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 10GBase-T with Intel®X550
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
4 USB 3.2 Gen1(2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)

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X14SBW-F

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 1GbE with Intel®I210
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
4 USB 3.2 Gen1 (2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)

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X14SBT-GAP

Key Features

Intel® Xeon® 6900-series processors with P-cores, Single Socket LGA-7529 (Socket BR) supported, CPU TDP supports Up to 500W TDP
Support DDR5 6400MT/s in 12 DIMM slots
8 PCIe 5.0 x8 via MCIO connectors to support AIOM, storage devices or PCIe expansion slots
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
1 PCIe 5.0 x8 GENZ 2C connector to support 2x M.2 (2280,22110) via proprietary M.2 adapter
I/O: 1 COM, TPM header

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X14SBT-G

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 512GB MRDIMM with speeds up to 8000 MT/s (1DPC) or 4TB of RDIMM(3DS) with speeds up to 6400 MT/s (1DPC) or 5200 MT/s (2DPC) in 16 DIMM slots
M.2 Interface: 2 PCIe5.0 x4 (Form Factor: 2280, 22110, M-Key)
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
I/O: 1 COM, TPM header

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X14SBSC

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 512GB MRDIMM with speeds up to 8000 MT/s (1DPC) or 4TB of RDIMM(3DS) with speeds up to 6400 MT/s (1DPC) or 5200 MT/s (2DPC) in 16 DIMM slots
1 PCIe 5.0 x8,
3 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 4.0 x2 via SAS3808n (Form Factor: 2280, 22110, M-Key)
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
I/O: 1 COM, TPM header, 1 VGA

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X14SBM-TP4F

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s or up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
4 PCIe 5.0 X8 via MCIO connectors
Quad LAN with 2x 10GBase-T and 2x 10G SFP+ with Intel® X710-TM4
4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports

Add to compare

X14SBM-TF

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s or up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 10GBase-T with Intel® X710-AT2
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports

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X14SBI-TF

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP up to 350W
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
3 PCIe 5.0 x16, 3 PCIe 5.0 x8,
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 22110, M-Key)
6 PCIe 5.0 x8 via MCIO connectors
Dual LAN with 10GBase-T with Intel®X550
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
4 USB 3.2 Gen1 (2 rear, 2 via header), 4 SATA3 (via SlimSAS x4)

Add to compare

X14SBI-F

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP up to 350W
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
3 PCIe 5.0 x16, 3 PCIe 5.0 x8,
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 22110, M-Key)
6 PCIe 5.0 x8 via MCIO connectors
Dual LAN with 1GbE with Intel®I210
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification
4 USB 3.2 Gen1 (2 rear, 2 via header), 4 SATA3 (via SlimSAS x4)

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X14SBHM

Key Features

Intel® Xeon® 6700/6500-seires processors with P-cores or Intel® Xeon® 6700-series processor with E-cores , Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 512GB MRDIMM with speeds up to 8000 MT/s (1DPC) or 4TB of RDIMM(3DS) with speeds up to 6400 MT/s (1DPC) or 5200 MT/s (2DPC) in 16 DIMM slots
2 PCIe 5.0 x16 M-XIO
1 PCIe 5.0 x16 AIOM
M.2 Interface: 2 PCIe 5.0 x2 M-PIC
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
AIOM for LAN
I/O: 1 DC-SCM

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