Product Naming Convention - Motherboards (AMD)
Character | Representation | Options |
1st + 2nd | CPU Type & Generation |
• H13 = 4th Gen AMD EPYC™ Processor • BH13 = Blade with 4th Gen AMD EPYC™ Processor |
3rd | # of CPU Support |
• D = Dual CPU • S = Single CPU |
4th | Socket |
• S = Socket SP5 • V = Socket SP6 (Value) |
5th |
Interface / Form Factor |
• C = SAS3 12Gbps (Broadcom) • D = Data Center Optimized • F = All Flash • FF = FatTwin® Front I/O • FR = FatTwin® Rear I/O • G = GPU Optimized • H = Hyper Architecture • i = SATA only • L = Cost Optimized • T = Twin Architecture • U = Ultra Architecture • W = WIO Architecture |
6th |
Interface / I/O Options / Memory Type |
• A = AIOM Support • B = BigTwin® • C = SAS3 12Gbps (Broadcom) • FP = 40G SFP+ • G = GrandTwin™ • i/E = SATA Only • LN4 = Four LAN ports • M = Module • M25 = Mellanox 25G • N = NVMe support • PS = TwinPro® • Q/H/O = Four/Six/Eight GPUs • S = SIOM Support • T = 10GBase-T • TP = 10G SFP+ |
7th | Others |
• CPU = CPU board • D = Delta |