SuperServer ARS-121L-NE316R (Complete System Only)

1U NVIDIA Grace CPU Superchip system supporting NVIDIA BlueField®-3 or NVIDIA Connect®X-7

ARS-121L-NE316R Main ARS-121L-NE316R Angle ARS-121L-NE316R Top ARS-121L-NE316R Front ARS-121L-NE316R Rear
Integrated Board: G1SMP
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Key Applications

  • Software-defined Storage
  • In-Memory Computing
  • Data Intensive HPC
  • Private & Hybrid Cloud
  • NVMe Over Fabrics Solution

Key Features

  1. Single NVIDIA Grace™ CPU Superchip, up to 144 Arm v9 cores, TDP 600W
  2. Up to 960GB LPDDR onboard memory
  3. 2 PCIe 5.0 x16 FHHL slots & 1 AIOM connector (OCP 3.0 SFF Compliant)
  4. 16 Front Hot-Swap E3.S (7.5mm) NVMe drive bays
  5. Reduntant Titanium 1600W Power Supplies
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ARS-121L-NE316R
Specifications Resources & Downloads
Specifications
Product SKUs
ARS-121L-NE316R
Motherboard
Super G1SMP
Processor
CPU
  • Single processor(s)
  • NVIDIA Dual 72-core CPUs on a Grace™ CPU Superchip
Note
  • Supports up to 600W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: Onboard Memory
  • Max Memory: Up to 960GB ECC LPDDR5X
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 1 USB 3.0 Type-A port(Rear)
Video
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Management
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-SG101E3-R000NDP
Dimensions and Weight
Height
  • 1.7" (43.6 mm)
Width
  • 17.2" (438.4 mm)
Depth
  • 30.4" (772.15 mm)
Package
  • 8.82" (H) x 26.46" (W) x 43.31" (D)
Weight
  • Gross Weight: 66.8 lbs (30.3 kg)
  • Net Weight: 43.6 lbs (19.8 kg)
Available Color
  • Silver
Front Panel
LED
  • HDD activity
  • LAN1 activity
  • LAN2 activity
  • Power Fail LED
  • Power status
  • System information
Buttons
  • Power On/Off
  • UID button
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default*
    • 2 PCIe 5.0 x16 (in x16) FHHL slots
  • Option A
    • 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 16 bays
    • 16 front hot-swap E3.S 1T NVMe drive bays
M.2
  • 2 M.2 NVMe slots (M-key)
System Cooling
Fans
  • 8 Removable heavy-duty 4cm Fan(s)
Power Supply
2x 1600W
2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL)73.5 x 40 x 203 mm
Input1000W: 100-127Vac
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac
1600W: 200-240Vac / 50-60Hz
+12VMax: 83.3A / Min: 0A (100Vac-127Vac)
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 133A / Min: 0A (200Vac-240Vac)
12V SBMax: 2.1A / Min: 0A
Output TypeBackplanes (gold finger)
CertificationTitanium Level94%+  Titanium Level

[ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads

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