SuperServer SYS-211SE-31AS

X13 SuperEdge 2U3-node UP front I/O short-depth server

SYS-211SE-31AS Main SYS-211SE-31AS Angle SYS-211SE-31AS Top SYS-211SE-31AS Node SYS-211SE-31AS Front SYS-211SE-31AS Rear
Integrated Board: X13SEED-SF
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Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Telecom DRAN, CRAN, and Edge Core Application
  • Enterprise Edge Computing

Key Features

Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node)
  2. 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s; R-DIMM / R-DIMM 3DS (per node)
  3. 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node)
  4. 2 NVMe M.2 2280/22110 (per node)
  5. 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
  6. Front-access 2000W AC Redundant Power Supplies (per system)
  7. Operating Temperature 0°C to 35°C ( 32°F to 95°F ) CPU TDP max 300W
    Operating Temperature 0°C to 55°C ( 32°F to 131°F ) CPU TDP max 205W
    Operating Temperature -5°C to 55°C ( 23°F to 131°F ) CPU TDP max 205W (Short Term)
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SYS-211SE-31AS
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-211SE-31AS
Motherboard
Super X13SEED-SF
Processor (per Node)
CPU
Core Count
  • Up to 52C/104T; Up to 97.5MB Cache
Note
  • Supports 85W - 300W TDP CPUs (Air Cooled)*
  • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
System Memory (per Node)
Memory
  • Slot Count: 8 DIMM slots/1 Channels
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices (per Node)
Chipset
  • Intel® C741
Network Connectivity
Input / Output (per Node)
LAN
  • 1 SFP 1 GbE LAN port (Intel® I210-IS) (IPMI shared on LAN port 1)
TPM
  • 1 TPM header
Others
  • 1 KVM dongle (output 1x VGA/1x COM/2x USB 2.0 via KVM cable) port
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support, PEPI
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-SE201-R2K07P
Dimensions and Weight
Height
  • 3.5" (88 mm)
Width
  • 17.7" (449 mm)
Depth
  • 16.9" (430 mm)
Package
  • 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight
  • Gross Weight: 70.6 lbs (32 kg)
  • Net Weight: 55.1 lbs (25 kg)
Available Color
  • Silver
Front Panel
LED
  • LAN1 activity
  • Power status
  • System information
Buttons
  • Power On/Off 
  • UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110; VROC required for RAID)
  • View M.2 Options
System Cooling
Air Shroud
  • 3 Air Shrouds
Fans
  • 12x 4cm heavy duty fans with optimal fan speed control 40x40x56mm Fan(s)
Power Supply
2x 2000W
2x 2000W Redundant (1 + 1) power supplies
Dimension (WxHxL)73.5 x 40 x 265 mm
Input1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz
+12VMax: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 166A / Min: 0A (220Vac-240Vac)
Certification 

[ Test Report ]
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13SEED-SF

CSE-SE201-R2K07P 		3

1 		Super X13SEED-SF Motherboard

2U Chassis
Add-on Card / Module AOM-BPN-SE3N-P 1 Backplane for SuperEdge 2U3N,RoHS
Cable CBL-0218L 3 11.5CM KVM/SUVI 36PIN TO 9PIN/15PIN/2USB
Riser Card RSC-W-66G5 3 1U LHS WIO Riser card with two PCIe 5.0 X16 slots,HF,R
RSC-WR-6G5 3 1U RHS WIO Riser card with one PCIe 5.0 X16 slot,HF,Ro
Software SFT-OOB-LIC 3 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P1046V 3 1U Prop. Passive HS for Intel B13 Blade Series
*Power Supply PWS-2K07F-1R 2 1U 2000W 90-264Vac/47-63Hz, wide DC input 180Vdc-300Vdc, 12V
*Power Distributor PDB-PT201-DSG 2 Super Edge pass through board support Ultra powers up to 6KW
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Optional sliding rail kit MCP-290-00144-1N - 2U fixed rail set, quick release, default for 2,3U 17.6"W, 26.5"-33.5" D
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor

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