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IoT y placas base integradas

Rendimiento fiablepara Embedded & IoTAplicaciones

Diseños de placas base tecnológicamente avanzados desde 1993
Diseño, componentes y experiencia en producción de la máxima calidad
Amplia gama de placas x86 para servidores
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Múltiples diseños, desde SBC Pico-ITX de 2,5" a ATX
Soporte de temperatura ampliado y ciclo de vida del producto prolongado

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Intel® Xeon® Processor E5-1600 v3(2)
Intel® Xeon® Processor E5-1600 v4(2)
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Intel® Xeon® processor E7-4800 series(1)
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Intel® Xeon® W-3400 series and Xeon® W-2400 series processors(1)
Intel® Xeon® W-3400/W-2400 Processors(1)
Intel® Processor N97(4)

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1 Slot(26)

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DDR5-6400MHz(13)
DDR5-5600MHz(34)
DDR5-5200MHz (OC)(3)
DDR5-5200MHz(1)
DDR5-4800MHz(41)
DDR5-4400MHz(17)
DDR4-4133+MHz (OC)(1)
DDR4-3866+MHz (OC)(3)
DDR4-3200MHz (OC)(2)
DDR4-3200MHz(99)
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DDR4-2666MHz(51)
DDR4-2400MHz(70)
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DDR4-1866MHz(7)
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DDR3-1333MHz(3)
DDR3 1600/1333/1066 MHz(1)

Special Features

Global SKU(24)

All motherboardsPrintCopy to clipboardURL535 Results

X14SBW-TF

Key Features

Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 10GBase-T with Intel®X550
4 USB 3.2 Gen1(2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Onboard TPM2.0

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X14SBW-F

Key Features

Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 1GbE with Intel®I210
4 USB 3.2 Gen1 (2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Onboard TPM2.0

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X14SBT-G

Key Features

Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM, DDR5-6400MT/s (1DPC) or DDR5-5200MT/s (2DPC) in 16 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
2 PCIe 5.0 x16 via Molex Impleplus connectors
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
M.2 Interface: 2 PCIe5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key
I/O: 1 COM, TPM header

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X14SBM-TP4F

Key Features

Intel® Xeon® 6700E-series processors, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
4 PCIe 5.0 X8 via MCIO connectors
Quad LAN with 2x 10GBase-T and 2x 10G SFP+ with Intel® X710-TM4
4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports

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X14SBM-TF

Key Features

Intel® Xeon® 6700E-series processors, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x16,
M.2 Interface: 2 PCIe 5.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
4 PCIe 5.0 X8 via MCIO connectors
Dual LAN with 10GBase-T with Intel® X710-AT2
4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports
Onboard TPM2.0

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X14SBHM

Key Features

Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM, DDR5-6400MT/s (1DPC) or DDR5-5200MT/s (2DPC) in 16 DIMM slots
2 PCIe 5.0 x16 M-XIO
1 PCIe 5.0 x16 AIOM
M.2 Interface: 2 PCIe 5.0 x2 M-PIC
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
AIOM for LAN
I/O: 1 DC-SCM

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X14SBH

Key Features

Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 1TB ECC RDIMM, DDR5-6400MT/s (1DPC) or DDR5-5200MT/s (2DPC) in 16 DIMM slots
2 PCIe 5.0 x16 4C
1 PCIe 5.0 x16 AIOM
M.2 Interface: 2 PCIe 5.0 x2
M.2 Form Factor: 2280, 22110, 25110
M.2 Key: M-Key
10 PCIe 5.0 x8 via MCIO connectors
AIOM for LAN
Onboard TPM2.0

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X14DBT-B

Key Features

support optional single CPU opeartion
6th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4710 (Socket E2) supported, CPU TDP up to 350W
total 16 DDR5 (up to 6400MT/s) DIMM slots
support CXL 1.0, 1.1, 2.0 Type-3 Memory
up to four M.2 22x110 with optional RAID
PCIe 5.0 NVMe and SAS storages with optional RAID
two PCIe 5.0x16 Riser cards supporting high speed interface
PCIe 5.0x16 to AIOM slot

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X14DBM-SP

Key Features

6th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4710 (Socket E2) supported, CPU TDP supports up to 350W
Support Single CPU Operation
Support DDR5 6400MT/s in 32 DIMM slots
M.2 Interface: 2 PCIe5.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key
8 NVMe ports PCIe 5.0 x8 via 8 MCIO connectors
Modular design. 32 DIMM, AIOM, up to 24 drives support.

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X14DBHM

Key Features

Intel® Xeon® 6 processors, LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Total up to 8TB ECC RDIMM DDR5-6400MT/s in 32 DIMM slots
1 Multi-Trak PCIe 5.0 x8
4 Multi-Trak PCIe 5.0 x16
M.2 Interface: 2 PCIe5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key
8 PCIe 5.0 x8 via MCIO connectors
2 AIOM PCIe 5.0 x16 slots
I/O: 1 DC-SCM

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X13SWA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Up to 350W TDP
Intel® W790
Up to 4TB(W-3400)/2TB(W-2400) 3DS ECC RDIMM, 1TB(W-3400)/512GB(W-2400) ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), in 16 DIMM slots
2 U.2 PCIe 3.0 for NVMe 2.5" SSD drives (U.2-1, U.2-2)
Xeon® W-3400 Series Processors: 6 PCIe 5.0 x16 Slots, support up to 6 Single Width/4 Double Width/2 Triple Width GPU cards Xeon® W-2400 Series Processors:3 PCIe 5.0 x16 Slots, support up to 3 Single Width/3 Double Width/2 Triple Width GPU cards (slot 3/5/7)
M.2 Interface: 4 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113C
8 SATA 3 (6Gb, RAID 0, 1, 5, 10)
Overclocking Supported (optional)
IPMI Supported

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X13SRN-H-WOHS

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-H

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-E-WOHS

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRN-E

Key Features

Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
Fast AI hardware acceleration
4 independent display with 4K resolution
First performance hybrid architecture from Intel
Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
High speed connectivity through dual 2.5GbE
Hailo-8™ powerful and efficient Edge AI solution integration ready
Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
12-24V wide range power with RVP and TVS
100% wide temp grade design and components applied

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X13SRA-TF

Key Features

Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W
Intel® W790
Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots
M.2 Interface: 2 PCIe 5.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Socket (w/o heat sink)
3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards
1 PCIe 4.0 x4 Slots
1GbE LAN port with Intel® Ethernet Controller I210-AT
10GbE LAN with Marvell AQC113
6 SATA 3 (6Gb, RAID 0, 1, 5, 10)
Overclocking Supported (optional)
IPMI Supported

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X13SEW-TF-OS1

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GBase-T with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header
2 SuperDOM with built-in power

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X13SEW-TF

Key Features

5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Intel C741® Chipset
Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
1 PCIe 5.0 x8 ( in x16)
1 PCIe 5.0 x32
M.2 Interface: 1 PCIe 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Dual LAN with 10GBase-T with Intel® X550
Intel® C741 controller for 10 SATA3 (6 Gbps) ports
4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
I/O: 1 VGA, 2 COM, 1 TPM header
2 SuperDOM with built-in power

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