SuperStorage 6129P-ACR12N4L

  Products  Systems   MegaDC   [ 6129P-ACR12N4L ]





Integrated Board
Super X11DPD-M25
Key Applications
- Hyperscale Data Center
- Database Processing & Storage

 
Key Features
1. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)
2. 16 DIMMs; up to 3TB 3DS ECC
    DDR4-2933MHz RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16 (HBA AOM),
    1 PCI-E 3.0 x8 Low Profile,
    1 PCI-E 3.0 x16 Low Profile,
    1 PCI-E 3.0 x16 (AIOM)
4. 12 Hot-swap 3.5" (tool-less)
    SAS3/SATA3 (4 NVMe/SAS3/SATA3 hybrid ports)
5. 2 M.2 NVMe/SATA up to 80mm
6. 2x 25Gb SFP28 onboard
7. 750W Redundant Power Supplies
    Platinum Level High-efficiency

 Learn more about MegaDC       Tested M.2 List 

Product SKUs
SSG-6129P-ACR12N4L
  • SuperStorage 6129P-ACR12N4L (Black)
 
Motherboard

Super X11DPD-M25
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP up to 205W*
Cores
  • Up to 28 Cores
Note BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
 
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
SAS
  • Broadcom 3216 SAS3 IT mode
Network Controllers
  • Mellanox CONNECTX-4 LX EN 25GbE
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output
LAN
  • 2x 25G SFP28 LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 2.0 ports (via header)
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
Others
  • TPM 2.0 Header, 1 Micro USB (COM Port)
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-LA26TS-R751AMAP
 
Dimensions and Weight
Width
  • 17.2" (437mm)
Height
  • 3.5" (89mm)
Depth
  • 25.5" (647mm)
Weight
  • Gross Weight: lbs ( kg)
  • Net Weight: lbs ( kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button (rear)
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots
PCI-Express
  • 1 PCI-E 3.0 x16 (HBA Add-on-Module)
  • 1 PCI-E 3.0 x8 Low Profile
  • 1 PCI-E 3.0 x16 Low Profile
  • 1 PCI-E 3.0 x16 (AIOM)
 
Drive Bays
Hot-swap
  • 12 Hot-swap 3.5" (tool-less) SAS3/SATA3 drive bays (4 NVMe/SAS3/SATA3 hybrid ports)
  • 2 Hot-swap 2.5" drive bays
M.2
  • M.2 Interface: 1 PCI-E 3.0 x4 and 1 PCI-E 3.0 x1
  • Form Factor: 2280
  • Key: M-Key
 
Backplane
SAS/SATA HDD Backplane
 
System Cooling
Fans
  • 3x 8cm high-performance PWM fans
 
Power Supplies
750W Redundant Power Supplies with PMBus
Total Output Power
  • 750W: 100 - 127Vac
  • 750W: 200 - 240Vac
Dimension
(W x H x L)
  • 73.5 x 40 x 203 mm
Input
  • 100-127Vac / 9.5A Max / 50-60Hz
  • 200-240Vac / 4.5A Max / 50-60Hz
+12V
  • Max: 62.5A / Min: 0A
+12Vsb
  • Max: 2.1A / Min: 0A
Output Type
  • 25 Pairs Gold Finger Connector
Certification Platinum Level Certified94%+  Platinum Level
 

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List

Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPD-M25
CSE-LA26TS-R751AMAP
1
1
Super X11DPD-M25 Motherboard
2U SCLA26 S-AIOM Chass w/ PWS, PDB
Backplane BPN-SAS3-LA26A-N12 1 2U 12-Slot LFF Backplane Supports 12 x SAS3/SATA3/NVMe4 Storage Devices with 1x(2x4) + 4x(1x4) power connectors, co-lay with BPN-SAS3-LA26A-N12,HF,RoHS
Cable 1 CBL-SAST-0901 1 [NR] 2x Slimline x8 (STR) to 2x Slimline x8 (STR),INT,49CM,8
Cable 2 CBL-SAST-0902 2 [NR] 2x Slimline x8 (STR) to 3x Slimline x4 (STR),INT,66CM,8
Heatsink / Retention SNK-P0068PS 2 2U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
* Power Supply PWS-751P-1R 2 1U 750W Redundant Platinum Single Output Power Supply w/Pmbus W73.5xH40xL203mm,RoHS/REACH
* Power Distributor PDB-PTLA26-8814 1 2U support redundanct powers up to 1600W power distributor b
Notes:
  1. Parts with * come with the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
  Part Number Qty Description
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.