Twin-Server-Lösung
Innovative Multi-Node-Architektur mit reduzierten TCO und TCE
X14/H14 2U4N FlexTwin™ with Liquid Cooling
Purpose-built HPC-at-scale solution
- CPU: Dual Intel Xeon 6900 series processors with P-cores or AMD EPYC™ 9005/9004 series processors per node
- Memory: Up to 24 DIMMs per node, 9TB DDR5 or 3TB MRDIMM
- Drives: Up to 2 front hot-swap E1.S PCIe 5.0 NVMe drive bays per node
- PCIe: 1 PCIe 5.0 x16 (LP) + 1 PCIe 5.0 x16 (FHHL) + 1 PCIe 5.0 x16 AIOM per node
X14 2U2N GrandTwin® with Intel® Xeon® 6
Purpose-Built Single-Socket Architecture with Front I/O and Modular Components
- CPU: Single Intel® Xeon® 6900 series processor with P-cores per node
- Memory: Up to 12 DIMMs per node, 3TB DDR5/MRDIMM
- Drives: Up to 4 hot-swap 2.5" NVMe drives per node
- PCIe: Up to 2 PCIe 5.0 x16 (in x16) FH/10.5"L slots per node
X14/H14 GrandTwin® with PCIe 5.0
Purpose-Built Single-Socket Architecture with Front or Rear I/O and Modular Components
- CPU: Single Intel® Xeon® 6700 series processor with E-cores or AMD EPYC™ 9005/9004 series processor per node
- Memory: Up to 16 DIMMs per node, 6TB DDR5
- Drives: Up to 8 hot-swap EDSFF E1.S or 6 hot-swap 2.5" NVMe/SATA drives per node
- PCIe: Up to 1 PCIe 5.0 slot or 2 PCIe 5.0 x16 AIOM slots per node
2U2N BigTwin mit PCIe 5.0
Flaggschiff-Multiknotenleistung für die anspruchsvollsten HCI- und Speicheranwendungen (X13)
- CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 12x hot-swap 2.5" NVMe/SAS/SATA or 6x 3.5" NVMe/SAS/SATA per node
- PCIe: 1x PCIe 5.0 x16 (LP) + up to 2x PCIe 5.0 x8 (LP) per node
X14 2U2N BigTwin® with Intel® Xeon® 6
Flagship Multi-Node Performance for the Most Demanding Cloud and Storage Applications
- CPU: Dual Intel® Xeon® 6700 series processors with E-cores per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 12 hot-swap 2.5" NVMe or 6 hot-swap 3.5" NVMe/SAS drives per node
- PCIe: Up to 3 PCIe 5.0 slots + 1 PCIe AIOM slot per node
2U4N BigTwin mit PCIe 5.0
Flaggschiff-Multiknotenleistung für die anspruchsvollsten HCI- und Speicheranwendungen (X13)
- CPU: Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 6x hot-swap 2.5" NVMe/SAS/SATA or 3x 3.5" NVMe/SAS/SATA per node
- PCIe: 2x PCIe 5.0 x16 (LP) per node
X14 2U4N BigTwin® with Intel® Xeon® 6
Flagship Multi-Node Performance for the Most Demanding Cloud and Storage Applications
- CPU: Dual Intel® Xeon® 6700 series processors with E-cores per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 8 hot-swap EDSFF E3.S, 6 hot-swap 2.5″ NVMe, or 3 hot-swap 3.5″ NVMe/SAS drives per node
- PCIe: Up to 2 PCIe 5.0 slots + 1 PCIe AIOM slot per node
2U4N GrandTwin mit PCIe 5.0
Speziell angefertigte Single-Socket-Architektur mit Front- oder Rear-I/O und modularen Komponenten (X13/H13)
- CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processor or AMD EPYC™ 9004 Series Processor per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 6x hot-swap 2.5" NVMe/SAS/SATA per node
- PCIe: Up to 2x PCIe 5.0 x16 AIOM per node
4U4N/4U8N FatTwin mit PCIe 5.0
Erweiterte E/A in einer Einzelprozessorarchitektur für Big Data- und HPC-Anwendungen (X13)
- CPU: Single 5th/4th Gen Intel® Xeon® Scalable Processors per node
- Memory: Up to 16 DIMMs per node, 4TB DDR5
- Drives: Up to 8x 3.5" NVMe/SAS/SATA or 6x 2.5" NVMe/SAS/SATA per node
- PCIe: 1x PCIe 5.0 x16 (LP) per node
2U2N BigTwin® with PCIe 4.0
Flagship Multi-Node Performance for the Most Demanding HCI and Storage Applications (X12/H12)
- CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors
- Memory: Up to 20 DIMMs (4 Intel® Optane® slots) per node, 4TB DDR4, support for Intel® Optane® persistent memory
- Drives: Up to 12x hot-swap 2.5"NVMe/SAS/SATA or 6x 3.5" NVME/SAS/SATA per node
- PCIe: 2x PCIe 4.0 x16 per node
2U4N BigTwin mit PCIe 4.0
Flaggschiff-Multiknotenleistung für die anspruchsvollsten HCI- und Speicheranwendungen (X12/H12)
- CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors or AMD EPYC™ 7003 Series Processors per node
- Memory: Up to 20 DIMMs (4 Intel® Optane® slots) per node, 4TB DDR4, support for Intel® Optane® persistent memory
- Drives: Up to 6x hot-swap 2.5"NVMe/SAS/SATA or 3x 3.5" NVME/SAS/SATA per node
- PCIe: 2x PCIe 4.0 x16 per node
2U4N GrandTwin mit PCIe 4.0
Speziell angefertigte Single-Socket-Architektur mit Front- oder Rear-I/O und modularen Komponenten (X12)
- CPU: Single 3rd Gen Intel® Xeon® Scalable Processor per node
- Memory: Up to 16 DIMMs per node, 4TB DDR4, support for Intel® Optane® Persistent Memory
- Drives: Up to 4x hot-swap 2.5" NVMe/SAS/SATA per node
- PCIe: 1x PCIe 4.0 x16 per node
4U4N/4U8N FatTwin mit PCIe 4.0
Advanced I/O in a Dual Processor Architecture for Big Data and HPC Applications (X12/H12)
- CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors or Single AMD EPYC™ 7003 Series Processors per node
- Memory: Up to 16 DIMMs per node, 4TB DDR4, support for Intel® Optane® Persistent Memory per node
- Drives: Up to 8x 3.5" NVMe/SAS/SATA or up to 6x 2.5" NVMe/SAS/SATA per node
- PCIe: 1x PCIe 4.0 x16 (LP) per node
1U2N TwinPro mit PCIe 4.0
Ultra-Dense Compute und Flexibilität für Cloud, Unternehmen und Rechenzentrum (X12)
- CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors per node
- Memory: Up to 16 DIMMs per node, 4TB per node
- Drives: 4x hot-swap 2.5" SAS/SATA per node
- PCIe: Up to 2x PCIe 4.0 x16 (LP) + 1x PCIe 4.0 x8 (M.2) per node
2U4N TwinPro mit PCIe 4.0
Ultra-Dense Compute und Flexibilität für Cloud, Unternehmen und Rechenzentrum (X12/H12)
- CPU: Dual 3rd Gen Intel® Xeon® Scalable Processors or AMD EPYC™ 7003 Series Processors per node
- Memory: Up to 16 DIMMs per node, 4TB DDR4
- Drives: 6x hot-swap 2.5" SAS/SATA or 3x 3.5" SAS/SATA per node
- PCIe: Up to 2x PCIe 4.0/3.0 x16 per node
Supermicro Rack-Scale HPC Systems with FlexTwin™ Accelerate Application Performance
New Supermicro High Density Rack-Scale Solution for HPC at Scale
Supermicro Rack-Scale HPC Systems with FlexTwin™ Accelerate Application Performance
New Supermicro HIgh Density Rack-Scale Solution for HPC at Scale
Innovative Solutions for Cloud Gaming, Media, Transcoding, & AI Inferencing
Sep 08 2022, 10:00am PDT
Supermicro and Intel product and solution experts will discuss, in an informal session, the benefits of the solutions in the areas of Cloud Gaming, Media Delivery, Transcoding, and AI Inferencing using the recently announced Intel Flex Series GPUs. The webinar will explain the advantages of the Supermicro solutions, the ideal servers and the benefits of using the Intel Flex Series GPUs.
Nitrado Delivers Exceptional Performance to Gamers Worldwide with the Latest Supermicro and Intel® Technology
Computing Infrastructure, Reducing Costs, and Increasing Engagement
Delivering Scalable Cloud-Gaming
Supermicro Systems with Intel® Data Center GPU Flex Series
Supermicro offers all the system components for cloud service providers to build green, cost-effective, and profitable cloud gaming infrastructure.
ELIOVP Increases Computing And Storage Power With Supermicro Servers For Blockchain Applications
ELIOVP Increases Performance by up to 35% and Capacity with State-Of-The-Art Servers as Demand Explodes
Supermicro TECHTalk: Highest-Density Multi-Node Server
SuperBlade systems enable data centers with the highest compute density for cloud-based applications. In this TechTalk, we show how the latest SuperBlade systems leverage the latest 3rd Gen Intel® Xeon® Scalable processors and high-speed networking technologies to provide unlimited data center configurability.
Construct Optimized IT Solutions With The Supermicro X12 Twin Family Of Multi-Node Servers
Select From the Twin Family of Multi-Node Servers to Exactly Match Workload Requirements with Superior Functionality and Efficiency
Supermicro AI / HPC Solution Bundle Featuring WekaFS™ and the latest Award Winning Twin Servers with 3rd Gen Intel® Xeon® Scalable Processors
Accelerate High Performance Workloads
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