SuperServer SYS-212B-FN4TP (Complete System Only)

X14 2U Short-depth Front I/O System with 4x 10G ports, 2x 2.5" NVMe and redundant AC/DC PSU

SYS-212B-FN4TP Main SYS-212B-FN4TP Angle SYS-212B-FN4TP Top SYS-212B-FN4TP Front SYS-212B-FN4TP Rear
Integrated Board: X14SBM-TP4F
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Key Applications

  • 5G Core and Edge
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing

Key Features

  1. Design with compliance to NEBS-Level 3
  2. Single Intel® Xeon® 6700E series processors with E-cores
  3. 8 DIMM slots supporting up to 1TB of memory
  4. Up to 4 PCIe 5.0 x16 (3 FHHL + 1 HHHL) &1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
  5. Onboard 2x 10GbE, 2X 10G SFP+
  6. Optional 2 front hot-swap 2.5" NVMe drive bays
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SYS-212B-FN4TP
Specifications Resources & Downloads
Specifications
Product SKUs
SuperServer SYS-212B-FN4TP
Motherboard
Super X14SBM-TP4F
Processor
CPU
Core Count
  • Up to 144C/144T; Up to 108MB Cache
Note
  • Supports up to 350W TDP CPUs (Air Cooled)*
  • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
GPU
Max GPU Count
  • Up to 4 single-width GPU(s)
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • PCIe
System Memory
Memory
  • Slot Count: 8 DIMM slots
  • Max Memory (2DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices
NVMe
  • NVMe; RAID 0/1 support(Intel® VROC RAID key required)
Chipset
  • System on Chip
Network Connectivity
  • 2 RJ45 10GBASE-T with Intel® X710-TM4
  • 2 SFP+ 10GbE with Intel® X710-TM4
  • View AOC Options
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port(s)
  • 2 SFP+ 10 GbE LAN port(s)
  • 2 RJ45 10 GbE LAN port(s) (Intel® X550-AT2)
USB
  • 2 USB 3.2 Gen1 Type-A port(s) (front)
  • 2 USB 3.2 Gen1 Type-A port(s) (Header)
Video
  • 1 VGA port(s)
Serial
  • 1 COM port(s) (Header)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power configurations
  • ACPI Power Management
  • Power-on mode for DC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support, PEPI
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-211M-R000NDP
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 11.8" (298.8 mm)
Package
  • 7.4" (H) x 19.3" (W) x 23.3" (D)
Weight
  • Gross Weight: 22 lbs (10 kg)
  • Net Weight: 17 lbs (7.7 kg)
Available Color
  • Silver/Black
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 FHHL slot(s)
    • 1 PCIe 5.0 x16 HHHL slot(s)
    • 1 PCIe 5.0 x8 HHHL slot(s)
  • Option A*
    • 3 PCIe 5.0 x16 FHHL slot(s)
    • 1 PCIe 5.0 x8 FHHL slot(s)
    • 1 PCIe 5.0 x8 HHHL slot(s)
  • Option B*
    • 3 PCIe 5.0 x16 FHHL slot(s)
    • 1 PCIe 5.0 x8 FHHL slot(s)
    • 1 PCIe 5.0 x16 HHHL slot(s)
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • View AOC Options
M.2
  • 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key)
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 2 bay(s)
    • 2 front hot-swap 2.5" NVMe drive bay(s)
M.2
  • 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110)
System Cooling
Fans
  • 4x 4-PIN PWM 8cm Fan(s)
Power Supply
2x 800W
2x 800W Redundant (1 + 1) power supplies
Dimension (WxHxL)54.5 x 40 x 220 mm
2x 600W
2x 600W Redundant (1 + 1) Typical 90%+ Level (92%) power supplies
Dimension (WxHxL)54.5 x 40 x 220 mm
5V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
2x 800W
2x 800W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL)54.5 x 40.25 x 220 mm
AC Input800W: 100-127Vac / 50-60Hz
860W: 200-240Vdc / 50-60Hz
860W: 200-240Vac / 50-60Hz
+12VMax: 66.67A / Min: 0A (100Vac-127Vac)
Max: 71.67A / Min: 0A (200Vdc-240Vdc)
Max: 71.67A / Min: 0A (200Vac-240Vac)
5V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C ~ 45°C (32°F ~ 113°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
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