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Programa Global SKU de Supermicro

Implantación, asistencia y servicio acelerados en todo el mundo

El Programa Global SKU de Supermicro ofrece servicios de cumplimiento y soporte optimizados para nuestras principales líneas de soluciones avanzadas de servidor, almacenamiento y redes para aplicaciones de centro de datos, computación en la nube, TI empresarial, Hadoop/Big Data, HPC y aplicaciones integradas. Como ventanilla única para todas las necesidades de construcción de sistemas del cliente, Supermicro se compromete a proporcionar la máxima flexibilidad para diseñar y desplegar soluciones informáticas de alto rendimiento y alta eficiencia para cualquier requisito de escala del cliente en cualquier lugar del mundo.

Las SKU globales de Supermicro ofrecen las siguientes ventajas:

  • Fácil identificación de sistemas, placas base y chasis seleccionados por su excelente rendimiento, popularidad y preferencia para crear soluciones de servidor altamente optimizadas.
  • Rápida integración y distribución a través de los avanzados centros de operaciones de Supermicro en EE.UU. (sede central en San José, CA), Taiwán y los Países Bajos, que dan servicio a las regiones de América, Asia-Pacífico (APAC), Europa, Oriente Medio y África (EMEA).
  • Control estratégico del inventario que garantiza la disponibilidad de grandes volúmenes, lo que reduce el plazo de entrega, disminuye los gastos generales de inventario en sus instalaciones, agiliza el despliegue y ofrece ventajas generales de TTM.
  • Ahorro adicional de costes gracias a la reducción de los gastos de envío y a la asistencia especializada en zonas horarias locales mediante la integración, la realización y la asistencia racionalizadas en centros logísticos y de servicios de todo el mundo.
  • Global Services para respuesta técnica y servicio in situ al siguiente día laborable o en 4 HORAS

Además, busque la designación del icono Mini Global SKU Mini Global SKU icon en determinados productos de nuestro sitio web.

En Supermicro, estamos comprometidos a apoyar a nuestros clientes con productos de la más alta calidad, soporte y servicio.

Systems
SKUForm Factor# of Nodes# of CPUCPU TypeChipsetSystem MemoryStorageNetworkingPower Supply
SYS-110P-FDWTR1U11
  • 3rd Gen Intel® Xeon® Scalable processors
  • Single Socket Socket P+ (LGA-4189) supported
  • TDP up to 205W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2048GB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 2x 2.5" SATA drive bays;
SYS-110P-WTR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket Socket P+ (LGA 4189) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 10x 2.5" SATA drive bays; 4x 2.5" NVMe hybrid;
SYS-120C-TN10R1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P4 (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 10x 2.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
  • Optional RAID support via RAID controller AOC
SYS-120H-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
  • Optional RAID support via RAID Controller AOC
SYS-120U-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • ul>
    • Slot Count: 32 DIMM Slots
    • Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 12x 2.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
SYS-210P-FRDN6T2U11
  • 3rd Gen Intel® Xeon® Scalable processors
  • Single Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 2x 2.5" hot-swap SATA drive bays;
SYS-220BT-HNC8R2U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA 4189) supported
  • TDP up to 205W;
Intel® C621A
  • ul>
    • Slot Count: 16 DIMM Slots
    • Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
  • Optional HBA support via SAS3808 Adapter
SYS-220BT-HNTR2U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA 4189) supported
  • TDP up to 205W;
Intel® C621A
  • ul>
    • Slot Count: 16 DIMM Slots
    • Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 6x 2.5" hot-swap NVMe/SATA drive bays; 6x 2.5" NVMe hybrid;
  • Optional RAID support via Intel® PCH
SYS-220H-TN24R2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
  • Optional RAID support via RAID Controller AOC
SYS-220HE-FTNRD2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
  • Optional RAID support via RAID Controller AOC
SYS-420GP-TNR4U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 32 DIMM slots
  • Up to 8TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe dedicated;
Redundant 750W Platinum level (94%)
SYS-510P-MR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket Socket P+ (LGA 4189) supported
  • TDP up to 220W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
SYS-510P-WTR1U11
  • Support Intel® 3rd Gen Xeon® Scalable Processors
  • Single Socket Socket P+ (LGA 4189) supported
  • TDP up to 270W;
Intel® C621A
  • 8 DIMM slots
  • Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
SYS-610U-TNR1U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • ul>
    • Slot Count: 32 DIMM Slots
    • Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 4x 3.5" hot-swap NVMe/SATA/SAS drive bays; 4x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
SYS-620C-TN12R2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P4 (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 12x 3.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
  • Optional RAID support via RAID controller AOC
SSG-620P-ACR12H2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
  • CPU not applicable to this JBOF system
  • Dual Socket Not Applicable (Not Applicable) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 12x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 2.5" NVMe hybrid;
  • Optional RAID support via RAID/HBA controller AOC
SYS-620P-TRT2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W;
Intel® C621A
  • ul>
    • Slot Count: 16 DIMM Slots
    • Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 8x 3.5" hot-swap drive bays;
SYS-620U-TNR2U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • ul>
    • Slot Count: 32 DIMM Slots
    • Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
    • Supports Intel® Optane™ persistent memory 200 series
  • 12x 3.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
  • Optional RAID support via RAID controller AOC
SSG-640P-E1CR36H4U12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
  • CPU not applicable to this JBOF system
  • Dual Socket Not Applicable (Not Applicable) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 36x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 2.5" NVMe hybrid;
  • Optional RAID support via RAID/HBA controller AOC
SYS-740GP-TNRTFull-Tower12
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 270W; 3 UPI
Intel® C621A
  • 16 DIMM slots
  • Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
  • 8x 3.5" hot-swap NVMe/SATA/SAS Support drive bays; 10x 2.5" NVMe dedicated;
SYS-F610P2-RTN4U82
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 185W; 3 UPI
Intel® C621A
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
  • 6x 2.5" 7mm drive bays
SYS-F620P3-RTBN4U42
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported
  • TDP up to 205W; 3 UPI
Intel® C621A
  • 8x 3.5" hot-swap SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
  • 8x 2.5" 7mm drive bays
AS -1014S-WTRT1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
System on Chip (SoC)
  • Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
  • 4 Hot-Swappable 3.5" SATA drive support; Optional 4 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A)500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load)
AS -1024US-TRT1U Chassis12
  • Dual AMD EPYC 7002/7003 series processor
System on Chip (SoC)
  • 32x DIMM slots, Up to 8TB ECC 3DS LRDIMM, Up to 3200 MHz
  • 4x hot-swap 3.5" drive bays support
Dual 10GBase-T RJ45 LAN ports via Intel Carlsville X710-AT2; 3 USB 3.0 ports (2 rear, 1 Type A)1000W Redundant Titanium Level (96%+) power supplies (Full redundancy based on configuration and application load)
AS -1114S-WTRT1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
System on Chip (SoC)
  • Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
  • 10 Hot-Swappable 2.5" SATA drive support; Optional 2 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A)500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load)
AS -4124GS-TNR17.2" x 7.0" x 29"12
  • Dual AMD EPYC™ 7003/7002 Series Processors
AMD EPYC™ 7002/7003 Series
  • 32DIMMs, up tp 8TB
  • Up to 24x 2.5" SAS/SATA drive bays 2x 2.5" SATA supported natively* 4x 2.5" NVMe supported natively RAID controller option available for 24 HDDs
2 RJ45 GbE LAN ports (rear) 1 RJ45 Dedicated IPMI LAN port2000W Redundant Power Supplies with PMBus Total Output Power 1000W: 100 – 127Vac 1800W: 200 – 220Vac 1980W: 220 – 230Vac 2000W: 230 – 240Vac 2000W: 220 – 240Vac (UL only) Dimension (W x H x L) 73.5 x 40 x 203 mm Input 100-127Vac / 12
SYS-1019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622 chipset
  • Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 10x 2.5" hot-swap SAS/SATA drive bay
Dual LAN with 10GBase-T with Intel® X722 + X557PWS-504P-1R
SYS-1029P-WTRT1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 10x 2.5" hot-swap SATA3/SAS3 drive bays, 2x 2.5" hot-swap NVMe/SAS3/SATA3 hybrid drive bays
Dual 10GBaseT LAN ports, 1 dedicated IPMI port, 4 rear USB3.0 ports, 2 front USB 3.0 portsRedundant 700/750W high-efficiency (Platinum Level) power supply
SYS-1029U-TR41U Chassis12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 10 hot-swap 2.5" drive support
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port750W Redundant Platinum Level Power Supplies
SYS-2029TP-HTR2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.5”)42
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • Quad set of 6x 2.5” hot-swap SATA drive bays
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus
SYS-4029GP-TRT4U Rackmount12
  • Up to
  • 24 x 2.5" Hot-swap SATA/SAS drives
2x 10GBase-T ports; Intel® X540 10GBase-T2000W(2+2) Redundant Power Supplies Titanium Level (96%+)
SYS-5019A-FTN41U Short Depth Rackmount11
  • Intel® Atom™ Processor Denverton C3758, SoC, 8 Cores, 25W
System on Chip
  • Up to 256GB Registered ECC DDR4-2400MHz or 64GB Unbuffered ECC/Non-ECC DDR4-2400MHz; in 4 DIMM slots
  • 1x 3.5" or 4x 2.5" HDD
4x 1GbE LAN, 1x dedicated IPMI LAN, 2x USB 2.0200W Low Noise AC-DC power supply with PFC
SYS-5019C-WR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)11
  • 8th/9th Generation Intel® Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor.
  • Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP * 95W CPU support up to 30 degree ambient
Intel® C246 chipset
  • Up to Up to 128GB Unbuffered ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
  • 4x 3.5" hot-swap drive bay
Dual LAN with Intel® Ethernet Controller I210-ATPWS-504P-1R
SYS-5019D-FN8TP1U Short Depth Rackmount11
  • Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
System On Chip
  • 4 x DDR4 DIMM 512 GB up to 2667MHz LRDIMM or 256GB RDIMM, ECC
  • 1x 3.5" or 4x 2.5"
2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0200W Low Noise AC-DC power supply with PFC
SYS-5019P-M1U 17.2" (437mm) x 1.7" (43mm) x 19.85" (503mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 165W
Intel® C621 chipset
  • Up to Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 4x 3.5" hot-swap SAS/SATA
Dual LAN with 1GbEPWS-350-1H
SYS-5019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)11
  • Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
  • Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel® C622 chipset
  • Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  • 4x 3.5" hot-swap SAS/SATA
Dual LAN with 10GBase-T with Intel® X722 + X557PWS-504P-1R
SYS-6019P-MTR1U Rackmount 437 x 43 x 508mm (17.2” x 1.7” x 19.98”)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
  • 4 Hot-Swap 3.5" SATA3 6Gb/s
2x 1GbE LAN Marvell 88E1512 PHY800W Redundant Power Supply, 80PLUS Platinum
SYS-6019P-WTR1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  • 4x 3.5" hot-swap SATA3/SAS3 drive bays
Dual 1G LAN ports, 1 dedicated IPMI port, 4 rear USB 3.0 portsRedundant 700/750W High-efficiency (Platinum Level) power supply
SYS-6019U-TR41U Chassis12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 4 hot-swap 3.5" drive support
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial PortRedundant 750W Platinum Level Power Supply
SSG-6029P-E1CR12H2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 12x 3.5" hot-swap SAS3/SATA3 drive bays
Dual LAN with 10GBase-T with Intel® X5571200W Titanium Level high-efficiency power supply
SYS-6029P-TR2U Rackmount Standard Barebone Mainstream Server12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 8x 3.5" hot-swap SATA3 drive bay
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port2x Redundant 1000W Redundant Power Supply Titanium Level (96% typical efficiency)
SYS-6029TP-HTR2U Rackmount 438 x 88 x 774mm (17.25” x 3.47” x 30.5”)42
  • Dual Socket P (LGA 3647) 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡, Dual UPI up to 10.4GT/s Support CPU TDP 70-165W*
Intel® C621 chipset
  • 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM Supports Intel® Optane™ DCPMM††
  • Quad set of 3x 3.5” hot-swap SATA drive bays
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus
SSG-6049P-E1CR36H4U 17.2" (437mm) x 7" (178mm) x 27.5" (699mm)12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Intel® C622 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 36x 3.5" hot-swap SAS3/SATA3 drive bays
Dual LAN with 10GBase-T with Intel® X5571200W Titanium Level high-efficiency power supply
SYS-7039A-IMid-Tower12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz in 16 DIMM slots
  • 4x 3.5" fixed drive bay, optional 4x 2.5" fixed drive bay
Dual GbE LAN from C6211200W High-efficiency (Platinum level) PWS
SYS-7049GP-TRT4U Rackmount/Workstation 462 x 178 x 673mm (18.2" x 7.0" x 26.5")12
  • Intel Xeon Scalable Processors with UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  • 8 Hot-swap 3.5" Drive Bays; (2x SATA3 ports default)
2 10GBase-T ports; Intel® X550 10GBase-T2200W Titanium Level efficiency redundant power supplies
SYS-7049P-TR2U Rackmount Standard Barebone Mainstream Server12
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Intel® C621 chipset
  • Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  • 8x 3.5" hot-swap SATA3 drive bay
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port2x Super Quiet 1280W Redundant Power Supply modules, high-efficiency Platinum Level (94% typical efficiency ),
SYS-E100-9S-L1U Box11
  • 7th Generation Intel® Core™ i3-7100U Processor
System on Chip
  • Up to 32GB Unbuffered non-ECC SO-DIMM, DDR4-2133MHz, in 2 DIMM slots
  • N/A
Dual LAN with Intel®PHY I219LM, 1 USB3.1, 2 USB3.0, 4 USB2.0, 4 COM (RS-232/422/485), 1 DIO via DB9, TPM2.0 onboardLockable 12V DC 60W power adapter
SYS-E100-9W-L11
  • 8th Generation Intel® Core™ i3-8145UE Processor.
  • Single Socket FCBGA-1528 supported, CPU TDP support Up to 15W TDP
System on Chip chipset
  • Up to 64GB Unbuffered non-ECC SO-DIMM, DDR4-2400MHz, in 2 DIMM slots
  • N/A
Single LAN with Intel® Ethernet Controller I210IT&lt;br&gt;Single LAN with Intel® PHY I219LM LAN controllerLockable 12V DC 60W power adapter
SYS-E300-9D-8CN8TP1U Compact Box with Rackmount available11
  • Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
System On Chip
  • DDR4-2666 512GB LRDIMM or 256GB Registered ECC RDIMM in 4 DIMM slots
  • 1x 2.5" fixed drive bay with bracket. (No 2.5" fixed drive bay when AOC area is occupied.)
2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0DC power adapter
SYS-E302-9A11
  • Intel® Atom® Processor C3558.
  • Single Socket FCBGA-1310 supported, CPU TDP support Up to 16W TDP
System on Chip chipset
  • Up to 256GB Registered ECC RDIMM, DDR4-2133MHz <br>Or 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2133MHz, in 4 DIMM slots
  • 2x 2.5" 7mm fixed drive bay
4x 1GbE, 1x dedicated IPMI LAN, 2x USB 2.0Lockable 12V DC 60W power adapter
SYS-E302-9D11
  • Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP
System on Chip chipset
  • Up to 256GB DDR4 ECC/non-ECC RDIMM
  • 2x 2.5" fixed drive bay with bracket
2x 10G SFP+, 2x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0150W 12V Lockable DC Power Adapter (Optional: 180W 12V Lockable DC Power Adapter)
Motherboards
MotherboardGeneration# of CPU SocketCPU Type SupportedForm FactorChipset# of System Memory SlotsOnboard Storage ControllerExpansion SlotOnboard LANGlobal SKU
X11SDV-8C-TP8F
X11SingleIntel® Xeon® Processor D-2146NT
Flex ATXSystem on Chip4SoC controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 3.0 x8,
  • 1 PCIe 3.0 x16
  • 1 Mini-PCIe
  • M.2 Interface: 1 SATA/PCIe 3.0 x4; 1 SATA/PCIe 3.0 x2
  • Form Factor: 2280, 3042
  • M.2 Key: M-Key, B-Key
  • U.2 interface: 2 PCI-E 3.0 x4
  • Dual LAN with 10Gbase-T
    Quad LAN with Intel® Ethernet Controller I350-AM4
    Dual LAN with 10G SFP+ LAN via SoC
Global SKU
X11SPL-F
X11Single2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
ATXIntel® C6218Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCIe 3.0 x8 (in x16 slot),
  • 4 PCIe 3.0 x8,
  • 1 PCIe 3.0 x4 (in x8 slot)
  • M.2 Interface: PCIe 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® I210
Global SKU
X11SSW-F
X11SingleIntel® Celeron®, Intel® Pentium®, Intel® 7th/6th Generation Core i3 series, Intel® Xeon® processor E3-1200 v6/v5
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 80W TDP
ProprietaryIntel® C2364Intel® C236 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 3.0 x16 Left Riser Slot,
  • 1 PCIe 3.0 x4 (in x16 slot)
  • M.2 Interface: PCIe 3.0 x4; SATA
  • Form Factor: 22110, 2260, 2280
  • M.2 Key: M-Key
  • Dual LAN with Intel® Ethernet Controller I210-AT
Global SKU
X11DPL-I
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 140W TDP, Dual UPI up to 10.4 GT/s
ATXIntel® C6218Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCIe 3.0 x16,
  • 3 PCIe 3.0 x8,
  • 1 PCIe 3.0 x4 (in x8 slot)
  • M.2 Interface: 1 SATA/PCIe 3.0 x4
  • Form Factor: 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
Global SKU
X11DPI-N
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62116Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 3.0 x16,
  • 2 PCIe 3.0 x8
  • M.2 Interface: PCIe 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 1GbE LAN with Intel® X722
Global SKU
X11DPI-NT
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62216Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 3.0 x16,
  • 2 PCIe 3.0 x8
  • M.2 Interface: PCIe 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Global SKU
A2SDi-8C-HLN4F
OthersSingleIntel® Atom® Processor C3758
Single Socket FCBGA-1310 supported, CPU TDP supports Up to 25W TDP
Mini-ITXSystem on Chip4SoC controller for 12 SATA3 (6 Gbps) ports
  • 1 PCIe 3.0 x4
  • M.2 Interface: SATA; PCIe 3.0 x2
  • Form Factor: 2280, 2242
  • M.2 Key: M-Key
  • Quad LAN with Intel® C3000 SoC, 1GbE
Global SKU
X11SPI-TF
X11Single2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
ATXIntel® C6228Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 3.0 x16,
  • 1 PCIe 3.0 x16 (x16 or x8 ),
  • 1 PCIe 3.0 x8 (x0 or x8 ),
  • 1 PCIe 3.0 x8,
  • 1 PCIe 3.0 x4 (in x8 slot)
  • M.2 Interface: PCIe 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Global SKU
X11SCL-F
X11Single8th/9th Generation Intel® Core™ i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 95W TDP
microATXIntel® C2424Intel® C242 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 3.0 x8 (in x16 slot),
  • 2 PCIe 3.0 x4 (in x8 slot)
  • M.2 Interface: 1 PCIe 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 1GbE with Intel® I210
Global SKU
X11DAi-N
X11Dual2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
E-ATXIntel® C62116Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 3.0 x16,
  • 2 PCIe 3.0 x8
  • M.2 Interface: PCIe 3.0 x4
  • Form Factor: 22110, 2280, 2260
  • M.2 Key: M-Key
  • Dual LAN with GbE from C621
Global SKU
X12SPA-TF
X12Single3rd Gen Intel® Xeon® Scalable processors, Intel® Xeon® W-3300 Processor
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
E-ATXIntel® C621A16Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 4.0 x16,
  • 3 PCIe 4.0 x8 (in x16 slot), PCIe x16 Slot#1 shares with M.2, Slot#2 shares with Slot#3 (NA/16,8/8), Slot#4 shares with Slot#5 (NA/16,8/8), Slot#6 shares with Slot#7 (NA/16,8/8)
  • M.2 Interface: 4 PCIe 4.0 x4
  • Form Factor: 2260/2280/22110
  • M.2 Key: M-Key
  • Single LAN with Intel® Ethernet Controller I210-AT
    Single LAN with Realtek RTL8211F PHY (dedicated IPMI)
    Single LAN with Marvell AQC113
Global SKU
X12SCV-LVDS
X12SingleIntel® Xeon® W-1200 Processors, 11th/10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3 Processor
Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 65W TDP
Mini-ITXIntel® W480E2Intel® W480E controller for 2 SATA3 (6 Gbps) ports; RAID 0,1
  • 1 PCIe 3.0 x16 slots (16/NA or 8/8)
  • M.2 Interface: 1 CNVi/PCIe 3.0 x1; 1 SATA/PCIe 3.0 x4
  • Form Factor: 2230, 2242/2280
  • M.2 Key: E-Key, M-Key
  • Single LAN with Intel® PHY I219LM LAN controller
    Single LAN with Intel® Ethernet Controller I210-AT
Global SKU
X12DPi-N6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A18Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 4.0 x16,
  • 2 PCIe 4.0 x8
  • 2 PCIe 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCIe 4.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i350 Gigabit Ethernet Controlle
Global SKU
X12DPi-NT6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A18Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 4.0 x16,
  • 2 PCIe 4.0 x8
  • 2 PCIe 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCIe 4.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12SPW-TF
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Proprietary WIOIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 4.0 x16 Right Riser Slot,
  • 1 PCIe 4.0 x32 Left Riser Slot,
  • 2 PCIe 4.0 x8 SlimSAS connector
  • 4 PCIe 4.0 x4 NVMe Internal Port(s)
  • M.2 Interface: PCIe 3.0 x4; SATA
  • Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12SPI-TF
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
ATXIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCIe 4.0 x16,
  • 1 PCIe 4.0 x8 (in x16 slot),
  • 2 PCIe 4.0 x8
  • 1 PCIe 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 SATA/PCIe 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with 10GBase-T with Intel® X550
Global SKU
X12DAI-N6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
E-ATXIntel® C621A16Intel® C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 4.0 x8,
  • 5 PCIe 4.0 x16
  • 4 PCIe 4.0 x4 NVMe Internal Port(s)
  • M.2 Interface: 2 PCIe 4.0 x4, RAID 0 & 1
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12DPL-i6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, Dual UPI up to 11.2 GT/s
ATXIntel® C621A8Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 4.0 x16
  • M.2 Interface: 1 PCIe 4.0 x4; 1 PCIe 4.0 x4
  • Form Factor: 2280/22110, 2280
  • M.2 Key: M-Key, M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12DPL-NT6
X12Dual3rd Gen Intel® Xeon® Scalable processors
Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, Dual UPI up to 11.2 GT/s
ATXIntel® C621A8Intel® C621A controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 4 PCIe 4.0 x16
  • 1 PCIe 4.0 x8 NVMe Internal Port(s)
  • M.2 Interface: 1 PCIe 4.0 x4; 1 PCIe 4.0 x4
  • Form Factor: 2280/22110, 2280
  • M.2 Key: M-Key, M-Key
  • Dual LAN with Intel® X550 10GBase-T Ethernet Controlle
Global SKU
X12SPL-F
X12Single3rd Gen Intel® Xeon® Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
ATXIntel® C621A8Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 4.0 x16,
  • 1 PCIe 4.0 x8 (in x16 slot),
  • 2 PCIe 4.0 x8,
  • 3 PCIe 3.0 x8
  • M.2 Interface: 1 SATA/PCIe 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Dual LAN with Intel® i210 Gigabit Ethernet Controlle
Global SKU
X12SAE-5
X12Single10th/11th Gen Intel® Core™ i9/i7/i5/i3 Processors, Intel® Xeon® W-1200/W-1300 Processors
Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP
ATXIntel® W5804Intel® W580 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 2 PCIe 4.0 x16 slots (16/NA or 8/8),
  • 2 PCIe 3.0 x1,
  • 1 PCI PCI 5V 32bit
  • M.2 Interface: 1 PCIe 4.0 x4, RAID 0 & 1; 2 PCIe 3.0 x4
  • Form Factor: 2280/22110
  • M.2 Key: M-Key
  • Single LAN with Intel® PHY I219LM LAN controller
    Single LAN with Intel® Ethernet i225V
Global SKU
H12DSU-iNR
H12DualAMD EPYC™ 7002 series (Rome) Processors, AMD EPYC™ 7003 series (Milan) Processors
ProprietarySystem on Chip32N/A
  • 8 PCIe 4.0 x4 NVMe Internal Port(s)
  • N/A
Global SKU
X11SCH-LN4F
X11Single8th/9th Generation Intel® Core™ i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor
Single Socket LGA-1151 (Socket H4) supported, CPU TDP supports Up to 95W TDP
Micro-ATXIntel® C2464Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCIe 3.0 x8 (in x16 slot),
  • 1 PCIe 3.0 x8
  • M.2 Interface: PCIe 3.0 x4
  • Form Factor: 22110, 2280
  • M.2 Key: M-Key
  • Quad LAN with Intel® Ethernet Controller I210
Global SKU
M12SWA-TF
M12SingleAMD Ryzen™ Threadripper™ PRO 3000 Series ProcessorsE-ATXAMD WRX808AMD WRX80 controller for 4 SATA3 (6 Gbps) ports, Software RAID 0,1,5,10
  • 6 PCI-E 4.0 x16Interface: 2 U.2 Sockets Software RAID 0,1 support
  • M.2 Interface: 4 PCI-E 4.0 x4
  • M.2 Form Factor: 22110, 2260
  • M.2 Key: M-Key
  • 1 1GbE with IntelⓇ I210-AT,
  • 1 Marvell AQC113C
Global SKU
H12DSU-iNR
H12DualAMD EPYC™ 7002 series (Rome) Processors, AMD EPYC™ 7003 series (Milan) ProcessorsProprietary 17" x 17"System on Chip32AMD SP3 SATA controller
  • 1 PCI-E 4.0 x32 Left Riser Slot
  • 1 PCI-E 4.0 x16 Right Riser Slot
  • 1 PCI-E 4.0 x40 Far Right Riser Slot
  • 1 Realtek RTL8211F PHY (dedicated IPMI)
Global SKU
Chassis
SKUForm FactorPower SupplyEfficient Power SupplyDrive Bays
CSE-847BE1C4-R1K23LPB4U1000W/1200W/1200W80 Plus Titanium38
CSE-846BE1C-R1K23B4U1000W/1200W/1200W80 Plus Titanium24
CSE-826BE1C4-R1K23LPB2U1000W/1200W/1200W80 Plus Titanium14
CSE-826BE1C-R920LPB2U920W80 Plus Platinum14
CSE-825TQC-R802LPB2U800W/800W80 Plus Titanium10
CSE-815TQC-R706WB21U700W/750W80 Plus Platinum4
CSE-813MFTQC-R407CB1U400W/400W80 Plus Platinum4
CSE-813MFTQC-350CB21U350W80 Plus Platinum4
CSE-743AC-1K26B-SQ4U1000W/1200W80 Plus Platinum8
CSE-732D4-668BMid-Tower668W80 Plus Platinum8
CSE-512L-200B1U200W2
CSE-512F-350B1Mini-1U350W80 Plus Platinum2
CSE-505-203BMini-1U200W80 Plus Gold9
CSE-504-203BMini-1U200W80 Plus Gold9
CSE-216BE1C-R920LPB2U920W80 Plus Platinum26

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