The Supermicro Multi-Node BigTwin® HCI System with 4th Gen Intel® Xeon® Scalable Processors Provides 2X the I/O Bandwidth with PCIe 5.0 and up to 1.5X the memory bandwidth with DDR5 and Supports Built-in CPU Accelerators for Workload Specific Performance Gains

Rich Set of New Systems to Support E3.S All-Flash Solutions and E3.S CXL Memory Module (CMM) Expansion Solutions with E3.S Drives Available from Every Flash Vendor, Increasing Customer Flexibility and Choice

Presenting an Open Forum of Industry Leaders on the Future of High-Performance Software Defined Storage for AI, HPC, and Data-Intensive Workloads

New MegaDC Servers Incorporate the New AmpereOne™ CPU for Microservices, Telco Edge, Web Servers, Caching Services, Media Encoding, and Video Game Streaming

Unique New Multi-Node System Provides Cost Optimized Performance at Scale for eCommerce, Software Development, Cloud Gaming, Content Creation, and Private Server Instances

The Evolving Portfolio of AMD EPYC 9004 Series Processor Systems is Optimized with up to 128 of the New “Zen 4c” Cores, and AMD 3D V-Cache Technology Drives Unprecedented Heights of Density and Energy Efficiency

From the Data Center to the Edge, Supermicro Designs and Manufactures Total Rack Scale Solutions to Achieve Superior Performance, Flexibility, and Energy Efficiency with Rapid Deployment

Supermicro Founder and CEO Charles Liang Will be Joined by Jensen Huang, NVIDIA CEO, and other Industry Luminaries to Outline Developments to Accelerate Cloud, AI, Edge, and Storage Workloads, Investments to Drive Rack Scale Manufacturing, and Innovations to Reduce the Environmental Impact of Today’s Data Centers with Green Computing Technologies

Supermicro CEO Delivers Keynote Address on the Latest System Innovations and Storage Solutions for Green AI and Sustainability

Liquid Cooled Large Scale AI Training Infrastructure Delivered as a Total Rack Integrated Solution to Accelerate Deployment, Increase Performance, and Reduce Total Cost to the Environment