3U-Systeme für 24, 12 oder 8 Knoten mit 4 DIMM-Steckplätzen
Hot-swap-fähige 3,5"- oder 2,5"-NVMe/SAS3/SATA3-Optionen
Integriertes 10-Gigabit-Ethernet für optimierte Kosteneffizienz
Neuerungen
Designed for Hyperscale and Cost Effectiveness
The MicroCloud modular architecture provides high density, serviceability and cost effectiveness required for today’s demanding hyperscale deployments. The 24/12/8 modular server nodes are conveniently integrated into a compact 3U chassis that is less than 30 inches deep, saving over 76% of rack space when compared to traditional 1U servers.
Power and Density Optimized
The MicroCloud family offers hyperscale data center optimized single socket computing solutions with the latest lower-power and high-density system-on-chip (SoC) processors, including Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors to enable a wide range of flexible and scalable cloud and edge computing solutions.
Front I/O Option for Easy Access and Serviceability
Power and I/O ports are located at the front of the chassis for rapid server provision, upgrades, and service. Rear I/O option is also available when hot-swappable storage is preferred.
Optimiert für:
Hosting & Content Delivery
Hyperscale / Hyperconverge
Ressourcenschonende Architektur
Datencenter
Cloud
Produktmerkmale
Formfaktor
3U MicroCloud Server-Gehäuse
Speicher
Bis zu 4 DIMM-Steckplätze, bis zu 512 GB DDR4-Speicher pro Knoten
Bis zu den Produktfamilien Intel® Xeon® Prozessor E5-2600 v4/v3, E3-1200 v6/v5, E/D-2100, Intel® Atom® Prozessor C3900
Laufwerke
Bis zu 4x 2,5" SATA3-Laufwerke oder 2x U.2 NVMe + 2x 2,5" SATA3-Laufwerke pro Knoten
Eingabe/Ausgabe
Bis zu 1 PCI-E x16 Low-Profile-Erweiterungssteckplatz mit flexiblen On-Board Micro-LP-Netzwerkoptionen
Dienstleistungen
Weltweite globale Dienstleistungen
Ressourcen
Supermicro MicroCloud with 8x AMD Ryzen AM5 Nodes at Computex 2023
By Cliff Robinson -
Many of our readers are already familiar with the Supermicro MicroCloud. The MicroCloud is popular in web and dedicated hosting markets where sharing the chassis, power, and cooling are desired while still maintaining physical nodes.