Key Features
- Compute Intensive Application
- HPC, Data Center
- Enterprise Server
- Financial Analysis
- Mission-critical applications
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††3. 2 PCI-E 3.0 x16 (LP) slots4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN5. 6 Hot-swap 2.5" SAS/SATA drive bays6. Broadcom 3108 SAS3 controller;
RAID 0, 1, 5, 6, 10, 50, 60 with
SuperCap option7. Up to 2200W Redundant Power Supplies Titanium Level (96%)
Barebone or Complete System requires SIOM or network card installed per node.
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W*
Cores
Up to 28 Cores
Note
* Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors.
Note
*Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment.
Note
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
(per Node)
Memory Capacity
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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