SuperServer ARS-111GL-DNHR-LCC (Complete System Only)

1U 2-Node NVIDIA GH200 Grace Hopper Superchip system with liquid-cooling supporting NVIDIA BlueField-3 or NVIDIA ConnectX-7

ARS-111GL-DNHR-LCC Main ARS-111GL-DNHR-LCC Top ARS-111GL-DNHR-LCC Front ARS-111GL-DNHR-LCC Rear
Integrated Board: G1SMH-G
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI

Key Features

This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details.

Two nodes in a 1U form factor. Each node supports the following:

  1. High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)
  2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
  3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
  4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
  5. 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
  6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
  7. This system supports two E1.S drives directly from the processor only.
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ARS-111GL-DNHR-LCC
Specifications Resources & Downloads
Specifications
Product SKUs
ARS-111GL-DNHR-LCC
Motherboard
Super G1SMH-G
Processor (per Node)
CPU
  • NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note
  • Supports up to 2000W TDP CPUs (Liquid Cooled)​
GPU (per Node)
Max GPU Count
  • Up to 1 onboard GPU
Supported GPU
  • NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
  • View GPU Options
CPU-GPU Interconnect
  • NVLink®-C2C
GPU-GPU Interconnect
  • PCIe
System Memory (per Node)
Memory
  • Slot Count: Onboard Memory
  • Max Memory: Up to 480GB ECC LPDDR5X
  • Additional GPU Memory: Up to 96GB ECC HBM3
On-Board Devices (per Node)
Chipset
  • System on Chip
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 ports(rear)
Video
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Management
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-GP102TS-R000NDFP
Dimensions and Weight
Height
  • 1.75" (44 mm)
Width
  • 17.33" (440 mm)
Depth
  • 37" (940 mm)
Package
  • 9.5" (H) x 48" (W) x 28" (D)
Weight
  • Gross Weight: 65.5 lbs (29.7 kg)
  • Net Weight: 48.5 lbs (22 kg)
Available Color
  • Silver
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
Drive Bays / Storage (per Node)
Drive Bays Configuration
  • Default: Total 4 bays
    • 4 front hot-swap E1.S NVMe drive bays
M.2
System Cooling
Fans
  • 7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 2700W
2x 2700W Redundant Titanium Level (96%) power supplies
Dimension (WxHxL)73.5 x 40 x 185 mm
Input2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)
+12VMax: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)
12V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads

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