X14DBG-AP

Key Features


  1. Intel® Xeon® 6900-series processors with P-cores, Dual Socket LGA-7529 (Socket BR) supported, CPU TDP supports up to 500W 
  2. Support DDR5 6400MT/s in 24 DIMM slots
  3. 20 PCIe 5.0 x8 MCIO connectors
  4. 1 PCIe 5.0 x8 slot for IO riser card
  5. 2 M.2 PCIe5.0 x4
  6. 1 AIOM slot
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X14DBG-AP
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 17" x 14.95" (43.18cm x 37.97cm)
Processor
CPU
Core
  • Up to 128 (P) cores
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 6TB 3DS ECC Registered RDIMM, DDR5-6400MT/s
Memory Type
  • ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 8800 MT/s (MRDIMM 1DPC) or 6400 MT/s (RDIMM 1DPC)
DIMM Sizes
  • 16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
  • RDIMM: 16GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
Network Controllers
  • N/A
Expansion Slots
PCIe
  • 1 PCIe 5.0 x16 AIOM,
  • 20 PCIe 5.0 x8 PCIe5.0 MCIO connector,
  • 1 PCIe 5.0 x8 Riser Slot
M.2
  • M.2 Interface: 2 PCIe 5.0 x4
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI 64MB AMI UEFI
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.7 or later
  • UEFI 2.9
PC Health Monitoring
Voltage
  • System temperature, PCH temperature, +5V standby, +5V, +3.3V, +12V, Monitors CPU Core Voltages, BMC/IPMI Heartbeat LED, +3.3V standby, Vmem, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI), Vcore, ACPI power management, Low noise fan speed control, GPUtemperature, DIMMtemperature
FAN
  • 4x 4-pin fan headers (up to 4 fans)
  • CPU thermal trip support
Other Features
  • Control of power-on for recovery from AC power loss
Resources
Servers (Optimized for X14DBG-AP)
Parts List

X14DBG-AP (For SuperServer Only) Coming Soon

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