2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel® C622 chipset
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
Expansion slots: 1 PCIe 3.0 x8 (in x16), 1 PCIe 3.0 x32 Left Riser slot
M.2 NGFF connector M.2 Interface: PCIe 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
I/O: 1 VGA, 2 COM, TPM header
2 SuperDOM with built-in power
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SpecificationsResourcesParts List
Specifications
Product SKUs
MBD-X11SPW-CTF
Physical Stats
Form Factor
Proprietary WIO
Dimension
8" x 13" (20.32cm x 33.02cm)
Processor
CPU
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Single Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP
Core
Up to 28 cores
System Memory
Memory Capacity
6 DIMM slots
Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MT/s
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
