Supermicro Introduces New Edge Computing and IoT Solutions at Embedded World 2018
NUREMBERG, Germany, Feb. 27, 2018 — Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced that it is highlighting new additions to its extensive edge computing and gateway product portfolio, including solutions based on the new Intel® Xeon® D-2100 SoC (System-on-a-Chip) and Intel® Atom® C3000 SoC processor at Embedded World 2018 from February 27-March 1, Nuremberg Exhibition Centre booth 1-330.
Leveraging its deep expertise in server technology, Supermicro is introducing a full line of solutions that support the latest Intel® Xeon® D-2100 SoC processors (codenamed Skylake-D) with up to 1.6x compute performance improvement compared to the last generation. The X11SDV series motherboards offer infrastructure optimization by combining the performance and advanced intelligence of the new system-on-a-chip processors into a dense, lower-power compact solution ideal for embedded applications.
“As the 5G era continues to emerge and Edge computing becomes more prevalent, Supermicro is ready with the industry’s best selection of embedded servers and motherboards to service a wide range of vertical markets including industrial automation, retail, medical, transportation, communication, and networking,” said Charles Liang, President and CEO of Supermicro. “With the vast growth of data driven workloads across embedded applications, Supermicro remains committed to developing powerful, scalable yet agile IoT gateway and compact server, storage and networking solutions that deliver the best ecosystems for the Edge with ease of deployment and open scalability.”
With server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, Supermicro’s X11SDV platforms deliver balanced compute, storage and networking for the intelligent Edge. These advanced technology building blocks offer the best workload optimized solutions and long life availability with up to 18 processor cores, up to 512GB DDR4 four-channel memory operating at 2666MHz, up to four 10GbE LAN ports with RDMA support, and available with integrated Intel® QAT (Quick Assist Technology) crypto/encrypt/decrypt acceleration engine and internal storage expansion options including mini-PCIe, M.2 and NVMe support.
For more details on Supermicro’s solutions that support high-performance Intel® Xeon® D SoC processors, please visit www.supermicro.com/products/nfo/Xeon-D.cfm.
In addition to these new solutions in compact box and 1U rack systems, Supermicro is also showcasing the latest low-power Intel® Atom® embedded solutions in fan-less compact box, short-depth 1U rack and mini-tower systems. For more information on these diverse low-power products, please go to: www.supermicro.com/products/nfo/Atom.cfm.
Supermicro is demonstrating fan-less modular solutions using passive cooling techniques that can operate in extreme temperature and provide protection from dust ingress and condensation with IP51 (Ingress Protection) certification, too. The industrial grade compact enclosure designs provide modular expansion housing ultra-small form factor 3.5” SBC or 2.5” Pico-ITX designs with integrated DC power support, storage expansion and wireless networking capabilities.
For more information on Supermicro’s complete line of Embedded Building Block Solutions visit www.supermicro.com/Embedded or download an Embedded Solutions Brochure.
