H11SSW-iN

A+ Products Motherboards [ H11SSW-iN ]
H11SSW-iN
Key Features
1. Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in
support requires board revision 2.x)
2. 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required)
3. Expansion slots:
1 PCI-E 3.0 x32 Left Riser Slot
1 PCI-E 3.0 x16 Right Riser Slot
M.2 Interface: 2 PCI-E 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-key
4. 12 NVMe via SlimSAS,
4 NVMe or 16 SATA3 via SlimSAS,
2 M.2,
2 SATA3
5. 2x 1GbE LAN Ports via Broadcom BCM5720L,
1 Realtek RTL8211E PHY (dedicated IPMI)
6. ASPEED AST2500 BMC graphics
7. Up to 7 USB 3.0 ports
(4 rear + 2 front + 1 Type A)
8. 6 PWM 4-pin Fans with tachometer status monitoring

Links & Resources
Tested Memory List
Tested HDD List
Tested M.2 List
Tested AOC List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility


Product SKUs
MBD-H11SSW-iN
  • H11SSW-iN
MBD-H11SSW-iN-B
  • H11SSW-iN (Bulk Pack)
Physical Stats
Form Factor
  • Proprietary
Dimensions
  • 13.4" x 12.29" (34cm x 31.2cm)
Processor/Chipset
CPU
  • Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required)
  • Socket SP3
Cores
  • Up to 32 Cores
  • Up to 64 Cores (Board revision 2.x required)
Chipset
  • System on Chip
System Memory
Memory Capacity
  • 16 DIMM slots
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
  • 8-channel memory bus
Memory Type
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
DIMM Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2.x required)
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA3 (6 Gbps)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • 2x 1GbE LAN Ports via Broadcom BCM5720L
  • 1 Realtek RTL8211E PHY (dedicated IPMI)
VGA
  • ASPEED AST2500 BMC
Input / Output
SATA
  • 2 SATA3 (6 Gbps) ports
SATA/NVMe Hybrid
  • 16 SATA3 / 4 NVMe
NVMe
  • 12 NVMe
LAN
  • 2 RJ45 1GbE Ethernet LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 7 USB 3.0 ports
    (4 rear + 2 front + 1 Type A)
VGA
  • 1 VGA port
Others
  • 2 COM ports (rear)
  • 2 SATA DOM power connectors
  • 1 TPM 2.0 header
  • 1 TPM 1.2 header
Expansion Slots
PCI-Express
  • 1 PCI-E 3.0 x32 Left Riser Slot
  • 1 PCI-E 3.0 x16 Right Riser Slot
M.2
  • Interface: 2 PCI-E 3.0 x2
  • Form factor: 2280, 22110
  • Key: M-key
Chassis ( Optimized for H11SSW-iN)
2U
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, +3.3V standby
  • CPU switching voltage regulator
  • Supports system management utility
  • VBAT
FAN
  • Up to 6-fan status tachometer monitoring
  • Up to 6 4-pin fan headers
  • Dual Cooling Zone
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 6x Fan connectors
  • I²C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
  • UID
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)
Bulk Pack List
Part Number Qty Description
H11SSW-iN MBD-H11SSW-iN-B 1 H11SSW-iN Motherboard
I/O Cable CBL-SAST-0813 1 SLIMLINE SAS x8 (LA) to SATA x4,INT, 16/26CM,32AWG
​
Retail Pack List
Part Number Qty Description
H11SSW-iN MBD-H11SSW-iN-O 1 H11SSW-iN Motherboard
I/O Cable CBL-SAST-0813 1 SLIMLINE SAS x8 (LA) to SATA x4,INT, 16/26CM,32AWG
​
Optional Parts List
Part Number Qty Description
I/O Cable CBL-SAST-0814 - SLIMLINE SAS x8 (LA) to 2x Oculink x4,INT,13CM,34AWG
I/O Cable CBL-SAST-0815 - SLIMLINE SAS x8 to 2x Oculink x4,INT, 22CM,34AWG
I/O Cable CBL-SAST-0816 - SLIMLINE SAS x8 (LA) to 2x Oculink x4,INT, 28CM,34AWG
TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;

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