SuperServer SYS-112B-FWT (Complete System Only)

1U Compact Edge Server with 2 NVMe/SATA bays

SYS-112B-FWT Main SYS-112B-FWT Angle SYS-112B-FWT Top SYS-112B-FWT Front SYS-112B-FWT Rear
Integrated Board: X14SBW-TF
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Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Artificial Intelligence (AI) on Edge
  • DU of 5G Application
  • Satellite Communication

Key Features

  1. Single Intel® Xeon® 6 6700 series processors with E-cores
  2. 8 DIMMs; Up to 1TB ECC DD5-6400 RDIMM
  3. 2x FHFL PCIe 5.0 x16;
    1x LP PCIe 5.0 x16
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SYS-112B-FWT
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-112B-FWT
Motherboard
Super X14SBW-TF
Processor
CPU
Core Count
  • Up to 144C/160T; Up to 60MB Cache
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 1 single-width GPU(s)
Supported GPU
System Memory
Memory
  • Slot Count: 8 DIMM slots/8 Channels
  • Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
  • Supports Intel® Optane™ persistent memory 200 series
  • View Memory Options
On-Board Devices
SATA
  • SATA (6Gbps)
Chipset
  • System on Chip
Network Connectivity
Input / Output
LAN
  • 2 RJ45 10 GbE LAN port(s)
USB
  • 2 USB 3.2 Gen1 Type-A port(s) (rear)
  • 2 USB 3.2 Gen1 port(s) (Header)
Video
  • 1 VGA port(s)
Serial
  • 1 COM port(s) (Rear)
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
CPU
  • Monitors for CPU Cores, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages.
Voltage
  • Voltage, VBAT, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, VRM temperature, CPU thermal trip support, 1.8V standby
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-515B-R000WNP2
Dimensions and Weight
Height
  • 1.7" (44.5 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 16.9" (429.3 mm)
Package
  • 8" (H) x 27" (W) x 24" (D)
Weight
  • Gross Weight: 15 lbs (6.8 kg)
  • Net Weight: 10 lbs (4.54 kg)
Available Color
  • Silver
Front Panel
LED
  • LAN1 activity
  • LAN2 activity
  • Power status
Buttons
  • Power On/Off 
Expansion Slots
PCI-Express (PCIe) Configuration
M.2
  • 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110)
Drive Bays / Storage
Drive Bays Configuration
M.2
System Cooling
Fans
  • 6x 4cm heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud(s)
Power Supply
2x 860W
2x 860W Redundant (1 + 1) Titanium Level (96%) Hot-plug power supplies
Dimension (WxHxL)54.5 x 40.25 x 220 mm
AC Input800W: 100-127Vac / 50-60Hz
860W: 200-240Vdc / 50-60Hz
860W: 200-240Vac / 50-60Hz
+12VMax: 66.67A / Min: 0A (100Vac-127Vac)
Max: 71.67A / Min: 0A (200Vdc-240Vdc)
Max: 71.67A / Min: 0A (200Vac-240Vac)
5V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
TPM Security Module AOM-TPM-9670V-O • 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
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