SuperServer SYS-821GE-TNMR2 (Complete System Only)

DP Intel 8U System with AMD MI300X 8-GPU and Rear I/O

SYS-821GE-TNMR2 Main SYS-821GE-TNMR2 Angle SYS-821GE-TNMR2 Top SYS-821GE-TNMR2 Top1 SYS-821GE-TNMR2 Front SYS-821GE-TNMR2 Rear
Integrated Board: X13DEG-MA
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training
  • Industrial Automation, Retail
  • Healthcare
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Climate and Weather Modeling
  • Finance & Economics

Key Features

  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors up to 350W with air cooling
  2. High density 8U system with AMD Instinct MI300X 8-GPU
  3. Up to 32 DIMMs supporting up to 8TB DDR5-4400 in 2DPC or 4TB DDR5-5600 in 1DPC
  4. Flexible networking options
  5. 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
  6. 8x 2.5" Hot-swap SATA drive bays, 2x M.2 NVMe for boot drive, up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)
  7. 6 Redundant 3000W Titanium Level power supplies
  8. 8U Rackmount chassis with 33.2" (843mm) depth
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SYS-821GE-TNMR2
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-821GE-TNMR2
Motherboard
Super X13DEG-MA
Processor
CPU
Core Count
  • Up to 64C/128T; Up to 320MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 8 onboard GPUs
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • AMD Infinity Fabric™ Link
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
  • 2 SFP28 25GbE with Broadcom® BCM57414 (optional)
  • 2 RJ45 10GbE with Intel® X710-AT2 (optional)
  • View AOC Options
Input / Output
USB
  • 1 USB 3.0 Type-A port(Rear)
Video
  • 1 VGA port
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
  • 8+4 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 8U Rackmount
Model
  • CSE-GP801TS-R000NPF-D2
Dimensions and Weight
Height
  • 13.8" (356 mm)
Width
  • 17.7" (447 mm)
Depth
  • 33.2" (843 mm)
Package
  • 27.6" (H) x 51" (W) x 29.5" (D)
Weight
  • Gross Weight: 178.6 lbs (81 kg)
  • Net Weight: 116.22 lbs (53 kg)
Available Color
  • Silver
Front Panel
Buttons
  • UID button
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 20 bays
    • 12 front hot-swap 2.5" NVMe drive bays
    • 8 front hot-swap 2.5" SATA drive bays
  • Option A: Total 4 bays
    • 4 front hot-swap 2.5" NVMe drive bays
  • View Drive Options
M.2
System Cooling
Fans
  • 10 heavy duty fans with optimal fan speed control
Power Supply
6x 3000W
6x 3000W Redundant Titanium Level (96%) power supplies
Dimension (WxHxL)106.5 x 82.1 x 245.5 mm
Input3000W: 0240Vdc / 50-60Hz (for CQC only)
2880W: 200-207Vac / 50-60Hz
3000W: 207-240Vac / 50-60Hz
3000W:
DC Input
+12VMax: 91.66A / Min: 0A (200Vac-240Vac)
12V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
8x Power Supply optional parts PWS-3K06G-2R • 2 AC-DC 3000W, Titanium efficiency, DC output: 54Vdc/45A
Side expention sets + 4 NVME driver AOM-GP401-PCIE-P 1 NIC Riser board(After Mid-Plane) for MI300X GPU System,RoHS
AOM-GP401-SW-P 1 NIC adaptor board with PLX switch for MI300X GPU system,RoHS
CBL-CDAT-0923A-40 1 I2C, (1x6F to 1x6F)/PH2.0,40CM,24AWG,2A/p,RoHS
CBL-MCIO-1255M5 • 2 MCIO x8 (STR to STR),55CM,30AWG,RoHS
CBL-MCIO-1419M5FXLC4-E 1 2 MCIOx8 (STR to STR),LtF,FOLD,19cm,32AWG,RoHS
CBL-PWEX-1142-30 1 MicroHi,(2x4 to 2x4),PH3.0,30CM,8A/pin,18AWG,RoHS

GPU SuperServer SYS-821GE-TNMR2 (Complete System Only ) Coming Soon

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