Key Features
- Compute Intensive Applications
- HPC, Data Center, Enterprise Server
- Hyperscale / Hyperconverged
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:1. Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)2. Up to 2TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 8 DIMM slots3. 2 PCI-E 4.0 x16 (LP) slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN • Software Out of Band License key
(SFT-OOB-LIC) included for
OOB BIOS management5. 3 Hot-swap 3.5" SATA3 drive bays M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110, 2260, 2242 M.2 Key: M-key6. 2000W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on
configuration and application load)
Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Supports CPU TDP / cTDP up to 280W*
Cores
Up to 64 Cores
Note
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
System Memory (per Node)
Memory Capacity
8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
Information in this document is subject to change without notice.
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