SYS-110P-FDWTR | 1U | 1 | 1 | - 3rd Gen Intel® Xeon® Scalable processors
- Single Socket Socket P+ (LGA-4189) supported
- TDP up to 205W;
| Intel® C621A | - 8 DIMM slots
- Up to 2048GB ECC RDIMM/LRDIMM, DDR4-3200MHz
| | | |
SYS-110P-WTR | 1U | 1 | 1 | - Support Intel® 3rd Gen Xeon® Scalable Processors
- Single Socket Socket P+ (LGA 4189) supported
- TDP up to 270W;
| Intel® C621A | - 8 DIMM slots
- Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 10x 2.5" SATA drive bays; 4x 2.5" NVMe hybrid;
| | |
SYS-120C-TN10R | 1U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P4 (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - 16 DIMM slots
- Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 10x 2.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
- Optional RAID support via RAID controller AOC
| | |
SYS-120H-TNR | 1U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | | - 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
- Optional RAID support via RAID Controller AOC
| | |
SYS-120U-TNR | 1U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - ul>
- Slot Count: 32 DIMM Slots
- Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 12x 2.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
- Optional RAID support via RAID controller AOC
| | |
SYS-210P-FRDN6T | 2U | 1 | 1 | - 3rd Gen Intel® Xeon® Scalable processors
- Single Socket Socket P+ (LGA-4189) supported
- TDP up to 270W;
| Intel® C621A | - 8 DIMM slots
- Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 2x 2.5" hot-swap SATA drive bays;
| | |
SYS-220BT-HNC8R | 2U | 4 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA 4189) supported
- TDP up to 205W;
| Intel® C621A | - ul>
- Slot Count: 16 DIMM Slots
- Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
- Optional HBA support via SAS3808 Adapter
| | |
SYS-220BT-HNTR | 2U | 4 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA 4189) supported
- TDP up to 205W;
| Intel® C621A | - ul>
- Slot Count: 16 DIMM Slots
- Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 6x 2.5" hot-swap NVMe/SATA drive bays; 6x 2.5" NVMe hybrid;
- Optional RAID support via Intel® PCH
| | |
SYS-220H-TN24R | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | | - 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
- Optional RAID support via RAID Controller AOC
| | |
SYS-220HE-FTNRD | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - 32 DIMM slots
- Up to 8TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
- Optional RAID support via RAID Controller AOC
| | |
SYS-420GP-TNR | 4U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - 32 DIMM slots
- Up to 8TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 8x 2.5" NVMe dedicated;
| | Redundant 750W Platinum level (94%) |
SYS-510P-MR | 1U | 1 | 1 | - Support Intel® 3rd Gen Xeon® Scalable Processors
- Single Socket Socket P+ (LGA 4189) supported
- TDP up to 220W;
| Intel® C621A | - 8 DIMM slots
- Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
| | |
SYS-510P-WTR | 1U | 1 | 1 | - Support Intel® 3rd Gen Xeon® Scalable Processors
- Single Socket Socket P+ (LGA 4189) supported
- TDP up to 270W;
| Intel® C621A | - 8 DIMM slots
- Up to 2TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 4x 3.5" NVMe/SATA drive bays; 4x 3.5" NVMe hybrid;
| | |
SYS-610U-TNR | 1U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - ul>
- Slot Count: 32 DIMM Slots
- Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 4x 3.5" hot-swap NVMe/SATA/SAS drive bays; 4x 2.5" NVMe hybrid;
- Optional RAID support via RAID controller AOC
| | |
SYS-620C-TN12R | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P4 (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - 16 DIMM slots
- Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 12x 3.5" hot-swap NVMe/SATA/SAS hybrid drive bays;
- Optional RAID support via RAID controller AOC
| | |
SSG-620P-ACR12H | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
- CPU not applicable to this JBOF system
- Dual Socket Not Applicable (Not Applicable) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | | - 12x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 2.5" NVMe hybrid;
- Optional RAID support via RAID/HBA controller AOC
| | |
SYS-620P-TRT | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W;
| Intel® C621A | - ul>
- Slot Count: 16 DIMM Slots
- Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 8x 3.5" hot-swap drive bays;
| | |
SYS-620U-TNR | 2U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - ul>
- Slot Count: 32 DIMM Slots
- Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
- Supports Intel® Optane™ persistent memory 200 series
| - 12x 3.5" hot-swap NVMe/SATA/SAS drive bays; 12x 2.5" NVMe hybrid;
- Optional RAID support via RAID controller AOC
| | |
SSG-640P-E1CR36H | 4U | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
- CPU not applicable to this JBOF system
- Dual Socket Not Applicable (Not Applicable) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | | - 36x 3.5" hot-swap SATA3/SAS3 drive bays; 4x 2.5" NVMe hybrid;
- Optional RAID support via RAID/HBA controller AOC
| | |
SYS-740GP-TNRT | Full-Tower | 1 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 270W; 3 UPI
| Intel® C621A | - 16 DIMM slots
- Up to 4TB ECC RDIMM/LRDIMM, DDR4-3200MHz
| - 8x 3.5" hot-swap NVMe/SATA/SAS Support drive bays; 10x 2.5" NVMe dedicated;
| | |
SYS-F610P2-RTN | 4U | 8 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 185W; 3 UPI
| Intel® C621A | | - 6x 2.5" hot-swap NVMe/SATA/SAS drive bays; 6x 2.5" NVMe hybrid;
- 6x 2.5" 7mm drive bays
| | |
SYS-F620P3-RTBN | 4U | 4 | 2 | - 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket Socket P+ (LGA-4189) supported
- TDP up to 205W; 3 UPI
| Intel® C621A | | - 8x 3.5" hot-swap SATA/SAS drive bays; 8x 2.5" NVMe hybrid;
- 8x 2.5" 7mm drive bays
| | |
AS -1014S-WTRT | 1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) | 1 | 1 | - Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
| System on Chip (SoC) | - Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
| - 4 Hot-Swappable 3.5" SATA drive support; Optional 4 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
| 2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A) | 500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load) |
AS -1024US-TRT | 1U Chassis | 1 | 2 | - Dual AMD EPYC 7002/7003 series processor
| System on Chip (SoC) | - 32x DIMM slots, Up to 8TB ECC 3DS LRDIMM, Up to 3200 MHz
| - 4x hot-swap 3.5" drive bays support
| Dual 10GBase-T RJ45 LAN ports via Intel Carlsville X710-AT2; 3 USB 3.0 ports (2 rear, 1 Type A) | 1000W Redundant Titanium Level (96%+) power supplies (Full redundancy based on configuration and application load) |
AS -1114S-WTRT | 1U Rackmount 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) | 1 | 1 | - Single AMD EPYC™ 7000-series Processor (up to 240W), AMD EPYC™ 7002 series and next generation processors
| System on Chip (SoC) | - Up to 2TB 3DS ECC RDIMM/LRDIMM; DDR4 up to 3200MHz, in 8 DIMM slots
| - 10 Hot-Swappable 2.5" SATA drive support; Optional 2 U.2 NVMe (PCIe Gen 3) drive support vs additional NVMe cables required
| 2 10GBase-T Ethernet via Broadcom BCM57416 Controller; 7 USB 3.0 ports (4 rear, 2 front, 1 Type A) | 500W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration and application load) |
AS -4124GS-TNR | 17.2" x 7.0" x 29" | 1 | 2 | - Dual AMD EPYC™ 7003/7002 Series Processors
| AMD EPYC™ 7002/7003 Series | | - Up to 24x 2.5" SAS/SATA drive bays
2x 2.5" SATA supported natively*
4x 2.5" NVMe supported natively
RAID controller option available for 24 HDDs
| 2 RJ45 GbE LAN ports (rear)
1 RJ45 Dedicated IPMI LAN port | 2000W Redundant Power Supplies with PMBus
Total Output Power
1000W: 100 – 127Vac
1800W: 200 – 220Vac
1980W: 220 – 230Vac
2000W: 230 – 240Vac
2000W: 220 – 240Vac (UL only)
Dimension
(W x H x L)
73.5 x 40 x 203 mm
Input
100-127Vac / 12 |
SYS-1019P-WTR | 1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) | 1 | 1 | - Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
- Single Socket P (LGA 3647) supported, CPU TDP support 205W
| Intel® C622 chipset | - Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
| - 10x 2.5" hot-swap SAS/SATA drive bay
| Dual LAN with 10GBase-T with Intel® X722 + X557 | PWS-504P-1R |
SYS-1029P-WTRT | 1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C622 chipset | - Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
| - 10x 2.5" hot-swap SATA3/SAS3 drive bays, 2x 2.5" hot-swap NVMe/SAS3/SATA3 hybrid drive bays
| Dual 10GBaseT LAN ports, 1 dedicated IPMI port, 4 rear USB3.0 ports, 2 front USB 3.0 ports | Redundant 700/750W high-efficiency (Platinum Level) power supply |
SYS-1029U-TR4 | 1U Chassis | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
- Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
| - 10 hot-swap 2.5" drive support
| 4 Gigabit Ethernet;
2 VGA ports (1 rear, 1 onboard)
5 USB 3.0 ports (2 rear, 2 front, 1 Type A);
1 Serial Port | 750W Redundant Platinum Level Power Supplies |
SYS-2029TP-HTR | 2U Rackmount
438 x 88 x 724mm (17.25” x 3.47” x 28.5”) | 4 | 2 | | Intel® C621 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
| - Quad set of 6x 2.5” hot-swap SATA drive bays
| Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node | 2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus |
SYS-4029GP-TRT | 4U Rackmount | 1 | 2 | | | | - 24 x 2.5" Hot-swap SATA/SAS drives
| 2x 10GBase-T ports; Intel® X540 10GBase-T | 2000W(2+2) Redundant Power Supplies Titanium Level (96%+) |
SYS-5019A-FTN4 | 1U Short Depth Rackmount | 1 | 1 | - Intel® Atom™ Processor Denverton C3758, SoC, 8 Cores, 25W
| System on Chip | - Up to 256GB Registered ECC DDR4-2400MHz or 64GB Unbuffered ECC/Non-ECC DDR4-2400MHz; in 4 DIMM slots
| | 4x 1GbE LAN, 1x dedicated IPMI LAN, 2x USB 2.0 | 200W Low Noise AC-DC power supply with PFC |
SYS-5019C-WR | 1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm) | 1 | 1 | - 8th/9th Generation Intel® Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor.
- Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP * 95W CPU support up to 30 degree ambient
| Intel® C246 chipset | - Up to Up to 128GB Unbuffered ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots
| - 4x 3.5" hot-swap drive bay
| Dual LAN with Intel® Ethernet Controller I210-AT | PWS-504P-1R |
SYS-5019D-FN8TP | 1U Short Depth Rackmount | 1 | 1 | - Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
| System On Chip | - 4 x DDR4 DIMM 512 GB up to 2667MHz LRDIMM or 256GB RDIMM, ECC
| | 2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0 | 200W Low Noise AC-DC power supply with PFC |
SYS-5019P-M | 1U 17.2" (437mm) x 1.7" (43mm) x 19.85" (503mm) | 1 | 1 | - Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
- Single Socket P (LGA 3647) supported, CPU TDP support 165W
| Intel® C621 chipset | - Up to Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
| - 4x 3.5" hot-swap SAS/SATA
| Dual LAN with 1GbE | PWS-350-1H |
SYS-5019P-WTR | 1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm) | 1 | 1 | - Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).
- Single Socket P (LGA 3647) supported, CPU TDP support 205W
| Intel® C622 chipset | - Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
| - 4x 3.5" hot-swap SAS/SATA
| Dual LAN with 10GBase-T with Intel® X722 + X557 | PWS-504P-1R |
SYS-6019P-MTR | 1U Rackmount
437 x 43 x 508mm (17.2” x 1.7” x 19.98”) | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
| - 4 Hot-Swap 3.5" SATA3 6Gb/s
| 2x 1GbE LAN Marvell 88E1512 PHY | 800W Redundant Power Supply, 80PLUS Platinum |
SYS-6019P-WTR | 1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm) | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
| - 4x 3.5" hot-swap SATA3/SAS3 drive bays
| Dual 1G LAN ports, 1 dedicated IPMI port, 4 rear USB 3.0 ports | Redundant 700/750W High-efficiency (Platinum Level) power supply |
SYS-6019U-TR4 | 1U Chassis | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
- Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
| - 4 hot-swap 3.5" drive support
| 4 Gigabit Ethernet;
2 VGA ports (1 rear, 1 onboard)
3 USB 3.0 ports (2 rear, 1 Type A);
1 Serial Port | Redundant 750W Platinum Level Power Supply |
SSG-6029P-E1CR12H | 2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
| Intel® C622 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
| - 12x 3.5" hot-swap SAS3/SATA3 drive bays
| Dual LAN with 10GBase-T with Intel® X557 | 1200W Titanium Level high-efficiency power supply |
SYS-6029P-TR | 2U Rackmount Standard Barebone Mainstream Server | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
| - 8x 3.5" hot-swap SATA3 drive bay
| Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port | 2x Redundant 1000W Redundant Power Supply Titanium Level (96% typical efficiency) |
SYS-6029TP-HTR | 2U Rackmount
438 x 88 x 774mm (17.25” x 3.47” x 30.5”) | 4 | 2 | - Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W*
| Intel® C621 chipset | - 16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
| - Quad set of 3x 3.5” hot-swap SATA drive bays
| Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node | 2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus |
SSG-6049P-E1CR36H | 4U 17.2" (437mm) x 7" (178mm) x 27.5" (699mm) | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
| Intel® C622 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
| - 36x 3.5" hot-swap SAS3/SATA3 drive bays
| Dual LAN with 10GBase-T with Intel® X557 | 1200W Titanium Level high-efficiency power supply |
SYS-7039A-I | Mid-Tower | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz in 16 DIMM slots
| - 4x 3.5" fixed drive bay, optional 4x 2.5" fixed drive bay
| Dual GbE LAN from C621 | 1200W High-efficiency (Platinum level) PWS |
SYS-7049GP-TRT | 4U Rackmount/Workstation
462 x 178 x 673mm (18.2" x 7.0" x 26.5") | 1 | 2 | - Intel Xeon Scalable Processors with UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
| - 8 Hot-swap 3.5" Drive Bays; (2x SATA3 ports default)
| 2 10GBase-T ports; Intel® X550 10GBase-T | 2200W Titanium Level efficiency redundant power supplies |
SYS-7049P-TR | 2U Rackmount Standard Barebone Mainstream Server | 1 | 2 | - 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
| Intel® C621 chipset | - Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
| - 8x 3.5" hot-swap SATA3 drive bay
| Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port | 2x Super Quiet 1280W Redundant Power Supply modules, high-efficiency Platinum Level (94% typical efficiency ), |
SYS-E100-9S-L | 1U Box | 1 | 1 | - 7th Generation Intel® Core™ i3-7100U Processor
| System on Chip | - Up to 32GB Unbuffered non-ECC SO-DIMM, DDR4-2133MHz, in 2 DIMM slots
| | Dual LAN with Intel®PHY I219LM, 1 USB3.1, 2 USB3.0, 4 USB2.0, 4 COM (RS-232/422/485), 1 DIO via DB9, TPM2.0 onboard | Lockable 12V DC 60W power adapter |
SYS-E100-9W-L | | 1 | 1 | - 8th Generation Intel® Core™ i3-8145UE Processor.
- Single Socket FCBGA-1528 supported, CPU TDP support Up to 15W TDP
| System on Chip chipset | - Up to 64GB Unbuffered non-ECC SO-DIMM, DDR4-2400MHz, in 2 DIMM slots
| | Single LAN with Intel® Ethernet Controller I210IT<br>Single LAN with Intel® PHY I219LM LAN controller | Lockable 12V DC 60W power adapter |
SYS-E300-9D-8CN8TP | 1U Compact Box with Rackmount available | 1 | 1 | - Intel Skylake Xeon D-2146NT SoC, 2.3GHz, 8 Core, 80W
| System On Chip | - DDR4-2666 512GB LRDIMM or 256GB Registered ECC RDIMM in 4 DIMM slots
| - 1x 2.5" fixed drive bay with bracket.
(No 2.5" fixed drive bay when AOC area is occupied.)
| 2 x 10G SFP+, 2 x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0 | DC power adapter |
SYS-E302-9A | | 1 | 1 | - Intel® Atom® Processor C3558.
- Single Socket FCBGA-1310 supported, CPU TDP support Up to 16W TDP
| System on Chip chipset | - Up to 256GB Registered ECC RDIMM, DDR4-2133MHz <br>Or 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2133MHz, in 4 DIMM slots
| - 2x 2.5" 7mm fixed drive bay
| 4x 1GbE, 1x dedicated IPMI LAN, 2x USB 2.0 | Lockable 12V DC 60W power adapter |
SYS-E302-9D | | 1 | 1 | - Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP
| System on Chip chipset | - Up to 256GB DDR4 ECC/non-ECC RDIMM
| - 2x 2.5" fixed drive bay with bracket
| 2x 10G SFP+, 2x 10GbE LAN, 4x 1GbE LAN, 1x dedicated IPMI LAN, 2 USB 3.0 | 150W 12V Lockable DC Power Adapter
(Optional: 180W 12V Lockable DC Power Adapter) |