Module Vendor
Module Part #
Chip Vendor
Chip Part #
PCB Module
Buffered Chips
Buffered Chips Part #
ATP Electronics
AG64L72T8SQC4C
Qimonda / Infineon
HYB25D256800BT-5B
9 x 2 ECC
0
-
ATP Electronics
AG64L64T8SQB3S
Samsung
K4H560838F-TCB3
8 x 2
0
-
ATP Electronics
AG64L72T8SQC4S
Samsung
K4H560838F-TCCC
9 x 2 ECC
0
-
Avant Technology
AVM6464U39C5400K5A
Vitelic
V58C2256804SAT5B
8 x 2
0
-
Buffalo Technology
DD4344-512/SD PC3200U-30440-B1
Samsung
K4H560838D-TCC4
8 x 2
0
-
Corsair
CM64SD512-3200 0324019 PC3200U-3330-Z1
Winbond
W942508CH-5
0322WI
8 x 2
0
-
Dataram
DTM63672B
Qimonda / Infineon
HYB25D256800BT-5
9 x 2 ECC
0
-
SimpleTech
S512M3NK2QK-S
Micron
46V32M8-5B C
8 x 2
0
-
Smart Modular Technologies
SM6472DDR2N1-S M381L6423DTM-CC4
Samsung
K4H560838D-TCC4
9 x 2 ECC
0
-
Super Talent Electronics, Inc.
D32PB12C2
Winbond
V58C2256804SA-T5B
8 x 2
0
-
Swissbit
SDU06464H1B22IN-50
Qimonda / Infineon
HYB25D256800BT-5
8 x 2
0
-
Ventura Technology Group
D51AVQ40SV
Samsung
K4H560838F-TCCC
8 x 2
0
-
Low-Profile Modules
ATP Electronics
AG64L64T8SQC4S
Samsung
K4H560838D-TCC4
8 x 2 Low-Profile
0
-
Wintec Industries
35746584 W21025
Samsung
K4H560838F-TCCC
9 x 2 Low-Profile ECC
0
-