H13SAE-MF

Key Features


  1. AMD Ryzen™ 7000 series Processors, single socket LGA-1718 (socket AM5) supported
    TDP supports up to 170W.
  2. Up to 192GB ECC/non-ECC Unbuffered DIMM, DDR5-5200MHz, in 4 DIMM slots.
  3. 2 PCIe 5.0 x16 (16/NA or 8/8), support up to 2 GPU cards(mechanical is up to 1 triple-width GPU card or 2 double-width GPU cards)
    1 PCIe 4.0 x4
  4. 2x 1Gbit LAN port(i210 AT); a dedicated Realtek 1Gbit LAN for IPMI.
  5. Micro-ATX form factor
  6. 1 USB 3.2 Gen2x2 ports (type C, 20Gb, rear); 5 USB 3.2 Gen2 ports(2 Type C, rear, support DP 1.4 Alt mode)
  7. 1 HDMI 2.0 port, 1 DP 1.4a port
  8. M.2 Interface: 2 PCIe 5.0 x4 (RAID 0 & 1)
    M.2 Form Factor: 2280/22110
    M.2 Key: M-Key
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-H13SAE-MF
Physical Stats
Form Factor
  • Micro-ATX
Dimension
  • 9.6" x 9.6" (24.384cm x 24.384cm)
Processor
CPU
  • AMD Ryzen™ 7000 series Processors
  • Single Socket LGA-1718 (Socket AM5) supported, CPU TDP supports Up to 170W TDP
Core
  • Up to 16 cores, 32 threads
System Memory
Memory Capacity
  • 4 DIMM slots
Memory Type
  • 5200/4800/3600 MT/s Up to 192GB of memory with speeds of up to 5200MT/s (1DPC)/ 3600MT/s (2DPC)
DIMM Sizes
  • 8GB, 16GB, 24GB, 32GB, 48GB
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • B650
SATA
  • 4 SATA3 ports; RAID 0,1,10
IPMI
  • ASPEED AST2600 BMC
Audio
  • ALC 888S HD Audio
Network Controllers
  • Dual LAN with Intel® i210 Gigabit Ethernet Controller
  • Single LAN with ASPEED AST2600 BMC, Dedicated LAN for IPMI
Input / Output
USB
  • 1 USB 3.2 Gen2x2 port(s) (1 rear type C 20Gb)
  • 5 USB 3.2 Gen2 port(s) (3 rear type A 10Gb; 2 rear type C DP 1.4 Alt mode)
  • 2 USB 3.2 Gen1 port(s) (2 headers 5Gb)
  • 1 USB 2 port(s) (1 via header 2 ports by a header)
Video Output
  • 1 HDMI 2.0 port(s), 1 DP 1.4a port(s), 2 rear type C port(s) DP 1.4 Alt mode
Serial Port
  • 1 COM Port(s) (1 header)
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • 1 PCIe 4.0 x4,
  • 2 PCIe 5.0 x16 slots (16/NA or 8/8)
M.2
  • M.2 Interface: 2 PCIe 5.0 x4, RAID 0 & 1
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.4
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • Plug and Play (PnP)
  • USB Keyboard support
Management
Software
Power Configurations
  • Power-on mode control for AC power loss recovery, Power button override mechanism, S3/S4/S5
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • System temperature, PCH temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
FAN
  • 7x 4-pin fan headers (up to 7 fans)
Operating Environment
Operating Temperature Range
  • 0°C - 50°C (32°F - 122°F)
Non-Operating Temperature Range
  • -20°C - 60°C (-4°F - 140°F)
Operating Relative Humidity Range
  • 10% - 85% (non-condensing)
Non Operating Relative Humidity Range
  • 10% - 95% (non-condensing)
Resources
Servers (Optimized for H13SAE-MF)
Chassis
Component Options
Software
Documentation
Parts List
H13SAE-MF New