Product Naming Convention - SuperBlade®/MicroBlade™ System
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| Character (Set) | Representation | Options |
| Prefix | Product Type |
• SBS = SuperBlade System • MBS = MicroBlade System |
| 1st | Enclosure Type |
• 820H • 314E |
| 2nd | Server Type |
• 420P • 4114S • 6119M • 6219M |
Product Naming Convention - SuperBlade® Server (X12 and above)
SBI- |
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LCC |
Prefix |
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| Character (Set) | Representation | Options |
| Prefix | Product Type | • SBI = SuperBlade supporting Intel CPU |
| 1st | Blade Height |
• 4 = 4U Blade • 6 = 6U Blade • 8 = 8U Blade |
| 2nd | # of CPU per Blade |
• 1 • 2 |
| 3rd | Blade Generation |
• 2 = X14 • 1 = X13 • 0 = X12 |
| 4th | Socket Type |
• P = Socket P+ (Intel) • E = Socket E (Intel) • B = Socket E2 (Intel) • BA = Socket BR (Intel) |
| 5th | # of Blades per row |
• 1 = 10 • 4 = 14 |
| 6th | Storage Interface | • N = NVMe Support |
| 7th | Type of Drives |
• E3 = E3.S • E1 = E1.S |
| 8th |
# of Hot-plug Drive Bays |
• 2, 3, 4, 5, 6, 8 = # of E3.S or E1.S |
| 6th | Storage Interface |
• C = SAS3 • T = SATA3 |
| 7th |
# of Hot-plug Drive Bays |
• 2 = 2x 2.5" • 3 = 3x 2.5" |
| 8th | NVMe Support |
• N = NVMe Support |
| 9th | Thermal Design | • LCC = Liquid Cool Cold Plate |
Product Naming Convention - SuperBlade® Servers (X10, X11, H12)
SBI- |
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Prefix |
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| Character (Set) | Representation | Options |
| Prefix | Product Type |
• SBI = SuperBlade supporting Intel CPU • SBA = SuperBlade supporting AMD CPU |
| 1st | Blade Height |
• 4 = 4U Blade • 6 = 6U Blade • 8 = 8U Blade |
| 2nd | Max # of Blades per row |
• 1 = 10 • 4 = 14 |
| 3th | # of CPUs per Blade |
• 1 • 2 |
| 4th | Blade Generation |
• 9 = X11 (Xeon Scalable) • 8 = X10 (Xeon E5-2600 v4/v3) • 4 or 9 = H12 (AMD EPYC) |
| 5th |
Socket *Supplemental Info |
• P = Socket P (Intel) • R = Socket R (Intel) • S = Socket SP3 (AMD EPYC 7000 series) • M = Mehlow (Intel) • W = Intel Xeon W-32xx * G = GPU |
| 6th | Storage Interface |
• C = SAS3 • T = SATA3 |
| 7th |
# of Hot-Plug Drive Bays |
• 2 = Two 2.5" • 3 = Three 2.5" • 4 = Four 2.5" • 6 = Six 2.5" • 8 = Eight 2.5" |
| 8th |
NVMe Support or Networking Type |
• N = NVMe Support • X = 10GbE |
Product Naming Convention - SuperBlade® Enclosures
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Prefix |
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| Character (Set) | Representation | Options |
| Prefix | Product Type |
• SBE = SuperBlade Enclosure |
| 1st | Form Factor |
• 4 = 4U enclosure • 6 = 6U enclosure • 8 = 8U enclosure |
| 2nd & 3rd | Number of Blades |
• 10 = 10 blades • 14 = 14 blades • 20 = 20 blades |
| 4th | Enclosure Type |
• E = Enterprise • J = 25/10/1G Ethernet • C = EDR IB / Omni Path support • H = HDR IB • L = TCO Optimized |
| 5th | Sub. Type |
• B = Battery Backup Enable • 2 = Single/Double Width Blade Enabled |
| 6th | Number of Power Supply |
• 8 = 8 Power Supplies • 6 = 6 Power Supplies • 4 = 4 Power Supplies • 2 = 2 Power Supplies |
| 7th & 8th |
Power Supply (Watt) |
• 20 = 2000W • 22 = 2200W • 30 = 3000W (Only supported by Sub. Type 2) |
| 9th | DC Power Supply |
• D = DC Power Supply |
| Example: 822 = 8 x 2200W / 422 = 4 x 2200W / 222 = 2 x 2200W | ||
Product Naming Convention - SuperBlade® Modules
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| Character (Set) | Representation | Options |
| Prefix | Product Type |
• SBM = SuperBlade Module |
| 1st - 3rd | SBM Initials |
• GEP = Gigabit Pass-Thru Switch • IBS = InfiniBand Switch • OPA = Omni Path Switch • 25G = 25G Ethernet Switch |
| 4th - 8th | SBM Description |
• X2C+ = Layer 2/3 Ethernet • X3S+ = Layer 2/3 Ethernet • X10SM = Layer 2/3 10Gb Ethernet • F8X4SM = Converged with FCoE • T20 = 20x 1G Pass-Thru • 002 = 14x 1G Pass-Thru • 002M = 10G Pass-Thru Ethernet • F3616M = 20 4x FDR • Q3616M = 20 4x QDR • E3616M = 20 4x EDR • H4020 = 24x 100G HDR • C4020 = 24x 100G OPA • P10 = 25G Pass-Thru Module • 100 = 25G Ethernet |
MBM- |
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Prefix |
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| Character (Set) | Representation | Options |
| Prefix | Product Type |
• MBM = MicroBlade Module |
| 1st - 3rd | MBM Initials |
• CMM = Chassis Management Module • GEM = 1 Gigabit Ethernet Switch • XEM = 10 Gigabit Ethernet Switch |
| 4th - 7th | MBM Description |
• 001 = (XEM) Intel Based Layer 2 • 001 = (CMM) DB9 Console Port • 002 = Broadcom Based Layer 2 • 002+ = Broadcom Based Layer 2 + RJ45 • 004 = Broadcom Based Gigabit Layer 2 • 100 = Marvell Based 10 Gigabit • FIO = Front I/O • FIO-V = Front I/O (signed FW) |