Supermicro's End-to-End Liquid-Cooled Solutions Propel Industry's Transition to Sustainable AI Data Centers with the NVIDIA Blackwell Platform

New JBOF Architecture Enables Storage ISVs and Cloud Service Providers to Build High-Performance, Efficient, and Intelligent Data Platforms for the Era of AI

New Supermicro Systems Enable Customers to Upgrade and Consolidate Data Centers for AI Workloads

New 3U Server Supports up to 18 GPUs and Features Dual Intel® Xeon® 6900 series processors with P-cores

Designed for Data Center Scale Reduction in TCO and Enabling Large AI Clusters to Perform with a Lower Energy Budget, Liquid Cooling Solution Handles the Highest Wattage Servers Containing the Latest NVIDIA GPUs and CPUs, Resulting in Lower Costs for AI Factories – Over 2,000 Liquid Cooled Racks Delivered Since June 2024

Companies combine engineering and design expertise for next generation systems supporting Gen AI and HPC workloads for on-prem and cloud data centers and the promotion of green IT

More than 15 Product Families of Completely Upgraded Servers Optimized for Maximum Performance or Efficiency, Featuring Next-Generation GPU Support, Higher-Bandwidth Memory, 400GbE Networking, E1.S and E3.S Drives, and Direct-to-Chip Liquid Cooling Support, and are Based on the New Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon 6700 Series Processors with E-cores

The New Rack-Scale Ready FlexTwin™ Systems Deliver Unprecedented Compute-Density in a Multi-Node Form Factor, with DLC dual CPUs up to 500W Each per Node, Front Node Access and Optimized Networking

A Complete Architecture Upgrade that Includes New Performance-Optimized CPUs, Next-Generation GPU support, Upgraded Memory MRDIMMs, 400GbE Networking, New Storage Options Including E1.S and E3.S drives, and Direct-to-Chip Liquid Cooling, based on the Upcoming Intel® Xeon® 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP) Supporting Demanding Workloads

5th Annual Summit Features 7 Sessions with 17 Leading Storage Technology Partners and 30 speakers to Discuss Best Practices and New Developments in Storage for AI, CSP, HPC, HCI and many other Workloads