Telecoms World Asia
Bangkok, Thailand
11 月 19 - 11 月 20, 2024
11 月 19 - 11 月 20, 2024
Join us for Telecoms World Asia this November
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Supermicro 在 SuperComputing 2024 展示最大的 HPC 最佳化多節點系統產品組合
全新的 FlexTwin™ 和新一代 SuperBlade®，每個機架最高可達 36,864 核心，具有直接晶片液體冷卻和升級技術，以最大幅度提高 HPC 效能
加州聖何塞和亞特蘭大2024年11月21日 /美通社/ -- Supercomputing Conference -- Supermicro, Inc. (納斯達克: SMCI) 為 AI/ML、HPC、雲端、儲存和 5G/Edge 提供全面 IT 解決方案供應商，展示其最新的高運算密度多節點解決方案，已就高強度 HPC 工作負載進行最佳化。這些系統包括創新的液體冷卻 FlexTwin 2U 4 節點專用 HPC 架構，以及業界領先的 SuperBlade SuperBlade，可在 6U 或 8U 機箱中最多 20 個節點，並提供多種儲存磁碟機選項。每個 SuperBlade 節點可容納一個 NVIDIA GPU，加速特定應用程式。Supermicro 多重節點以共用資源為特色，可提高效率並降低原物料的使用量，與標準機架安裝系統相比，密度大幅改善。
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Supermicro Delivers Direct-Liquid-Optimized NVIDIA Blackwell Solutions
Supermicro’s SuperClusters with NVIDIA HGXTM B200 8-GPU, NVIDIA GB200, NVL4, and NVL72 Systems Deliver Unprecedented AI Compute Density
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Supermicro, the So-Called 'NVIDIA of Servers,' Unveils Its Secret Weapon Amid Skepticism
In an interview with Vik Malyala he says, "Two years ago, server CPUs consumed 200W, but now the most powerful GPUs consume 1000W, and power consumption will continue to rise. If we don't make better server systems, more power will be wasted in the future, and it's our job to stop it."
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Supermicro's Liquid-Cooled SuperClusters for AI Data Centers Powered by NVIDIA GB200 NVL72 and NVIDIA HGX B200 Systems, Deliver a New Paradigm of Energy-Efficient Exascale Computing
Supermicro's End-to-End Liquid-Cooled Solutions Propel Industry's Transition to Sustainable AI Data Centers with the NVIDIA Blackwell Platform
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Supermicro推出全新集成NVIDIA BlueField-3 DPU的全快閃記憶Petascale JBOF超大規模儲存解決方案，加速AI數據管道
全新JBOF架構助力儲存獨立軟件供應商和雲端服務供應商，為人工智能時代構建高性能、高效且智能的數據平台
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Supermicro Introduces New Servers and GPU Accelerated Systems with AMD EPYC™ 9005 Series CPUs and AMD Instinct™ MI325X GPUs for AI Ready Data Centers
New Supermicro Systems Enable Customers to Upgrade and Consolidate Data Centers for AI Workloads
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