Module Vendor
Module Part #
Chip Vendor
Chip Part #
PCB Module
Buffered Chips
Buffered Chips Part #
ATP Electronics
AG28L64T8SMC4M
Micron
46V64M4-5B C
16 x 2
0
-
ATP Electronics
AG28L64T8SMC4M
Micron
46V64M4-5B C
16 x 2
0
-
ATP Electronics
AG28L72T8SHC4M
Micron
46V64M8-5B
9 x 2 ECC
0
-
ATP Electronics
AG28L64T8SHC4M
Micron
46V64M8-5B
8 x 2
0
-
ATP Electronics
AG28L64T8SHC4S
Samsung
K4H510838B-TCCC
8 x 2
0
-
Ventura Technology Group
D53AYQ40SV
Samsung
K4H510838B-TCCC
8 x 2
0
-
Wintec Industries
PC3200/1024MB 35155682
Micron
46V64M8-5B C
8 x 2
0
-
Low-Profile Modules
Apacer
77.11136.40G
Samsung
K4H510838C-UCCC
8 x 2 Low-Profile
0
-
Apacer
75.06398.G00
Samsung
K4H510838C-UCCC
9 x 2 Low-Profile ECC
0
-
ATP Electronics
AG28L72T8SHC4S
Samsung
K4H510838B-TCCC
9 x 2 Low-Profile ECC
0
-
Qimonda / Infineon Technology
HYS72D128320HU-B
Qimonda / Infineon
HYB25D512800BE-5B
9 x 2 Low-Profile ECC
0
-
Wintec Industries
35155684 W21057
Samsung
K4H510838B-TCCC
8 x 2 Low-Profile
0
-