Memory List
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Module Vendor Module Part # Chip
Vendor
Chip Part # PCB
Module
Buffered
Chips
Buffered
Chips Part #
ATP Electronics AG28L64T8SMC4M
Micron 46V64M4-5B C 16 x 2
0 -
ATP Electronics AG28L64T8SMC4M
Micron 46V64M4-5B C 16 x 2
0 -
ATP Electronics AG28L72T8SHC4M
Micron 46V64M8-5B 9 x 2
ECC
0 -
ATP Electronics AG28L64T8SHC4M
Micron 46V64M8-5B 8 x 2
0 -
ATP Electronics AG28L64T8SHC4S Samsung K4H510838B-TCCC 8 x 2
0 -
Ventura Technology Group D53AYQ40SV Samsung K4H510838B-TCCC 8 x 2
0 -
Wintec Industries PC3200/1024MB
35155682
Micron 46V64M8-5B C 8 x 2
0 -
Low-Profile Modules
ATP Electronics AG28L72T8SHC4S Samsung K4H510838B-TCCC 9 x 2
Low-Profile
ECC
0 -
Wintec Industries 35155684 W21057 Samsung K4H510838B-TCCC 8 x 2
Low-Profile
0 -
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.