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Module Vendor Module Part # Chip
Vendor
Chip Part # PCB
Module
Buffered
Chips
Buffered
Chips Part #
ATP Electronics AB32L72Q8SQB0S Samsung K4H560838D-TCB0 4 x 1
5 x 1
Reg. ECC
3 1x
(P16CV 857A
V0230D0C)
2x
(P174SSTV 16857A
0222AOC)
Transcend TS32MDR72V6F5 Mosel V58C2256804SAT7 9 x 1
Reg. ECC
2 PI6CV 857LA
V0249AOC PI74SSTV
16859ZB 0303AOC
MH
Low-Profile Modules
ATP Electronics AB32L72Q8SQB0S Samsung K4H560838E-TCB3 9 x 2
Low-Profile
Reg. ECC
2 PI74SSTV 16857A
0320XC
Nanya Technology NT256D72S89B0GU-75B Samsung NT5DS32M9BT-75B 9 x 2
Low-Profile
Reg. ECC
2 PI75SSTV 16857A
Z0206M
TW
SimpleTech S256M3RG1QK-S Samsung K4H560838E-TCCC 9 x 1
Low-Profile
Reg. ECC
2 PI74SSTV 328852NB
03390C
Wintec Industries 256MB 32X8 ECC PC2100-R 35932581L W20478 Qimonda / Infineon HYB25D256800BT-7B 5 x 1
4 x 1
Low-Profile
Reg. ECC
3 CK331508A
0336-006
SSTVF 16857AG
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.