X12DDW-A6

WIO

Key Features


  1. 3rd Gen Intel® Xeon® Scalable processors
    Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
  2. Intel® C621A
  3. Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB LRDIMM, DDR4-3200MHz
    Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz (OC), in 16 DIMM slots
  4. 1 PCIe 4.0 x16 Left Riser Slot,
    1 PCIe 4.0 x16 Right Riser Slot,
    2 PCIe 4.0 x16 Center Right Hand Slot,
    8 PCIe 4.0 NVMe Internal Port(s)
    M.2 Interface: 2 PCIe 2.0 x1
    M.2 Form Factor: 2260/2280
    M.2 Key: M-Key
    2 PCIe 4.0 x16, AIOM slots Superset of OCP 3.0 Expansion
  5. Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  6. 1 VGA D-Sub Connector port
  7. AIOM for LAN
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Optimized Servers


Specifications Resources Parts List
Specifications
Product SKUs
MBD-X12DDW-A6
Physical Stats
Form Factor
  • Proprietary WIO
Dimension
  • 12.288" x 13.404" (31.21cm x 34.05cm)
Processor
CPU
  • 3rd Gen Intel® Xeon® Scalable processors
  • Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core
  • Up to 40 cores
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s
  • Up to 4TB ECC LRDIMM, DDR4-3200MT/s; Up to 4TB ECC RDIMM, DDR4-3200MT/s
Memory Type
  • 3200/2933/2666 MT/s ECC DDR4 LRDIMM, RDIMM
DIMM Sizes
  • 16GB, 32GB, 64GB, 128GB, 256GB
  • LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
  • RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • Intel® C621A
SATA
  • Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2600 BMC
Graphics
  • 1 ASPEED AST2600 BMC port(s)
Network Controllers
  • AIOM for LAN
Input / Output
USB
  • 4 USB 3.1 Gen1 port(s) (2 via header; 2 rear)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 1 COM Port(s) (1 header)
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • 1 PCIe 4.0 x16 Left Riser Slot,
  • 1 PCIe 4.0 x16 Right Riser Slot,
  • 2 PCIe 4.0 x16 Center Right Hand Slot,
  • 2 PCIe 4.0 x16, AIOM slots Superset of OCP 3.0 Expansion
M.2
  • M.2 Interface: 2 PCIe 3.0 x2
  • Form Factor: 2260/2280
  • Key: M-Key
System BIOS
BIOS Type
  • AMI UEFI
Management
Software
System Management Software
  • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations
  • ATX Power connector
PC Health Monitoring
Voltage
  • PCH temperature, Monitors CPU voltages, CPU temperature, Chassis intrusion header, 6 -fan status, +5V standby, +12V, Memory Voltages, CPU thermal trip support, +1.8V PCH
LED
  • UID/Remote UID
  • Power LED
  • BMC/IPMI Heartbeat LED
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
FAN
  • 6 fans with tachometer status monitoring
Other Features
  • WOL, UID, RoHS, Node Manager Support, Chassis intrusion detection, ATX Power connector, ACPI power management, RoT, NCSI header
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Resources
Servers (Optimized for X12DDW-A6)
Chassis
Component Options
Software
Documentation
Parts List

X12DDW-A6

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